S-parameters characterization of through, blind, and buried via holes

IEEE Transactions on Mobile Computing

Volumn 2, Issue 2, 2003, Pages 174-184

  Antonini, Giulio ^a   Scogna, Antonio Ciccomancini ^a   Orlandi, Antonio ^a  

^a UNIVERSITY OF L'AQUILA   (Italy)

Author keywords

And through via holes; Blind; Buried; De embedding technique; Signal integrity

Indexed keywords

COMPUTER AIDED DESIGN; COMPUTER SIMULATION; LOCAL AREA NETWORKS; PRINTED CIRCUIT BOARDS; SCATTERING PARAMETERS; SIGNAL INTERFERENCE;

DEEMBEDDING TECHNIQUES; FINITE INTEGRATION TECHNIQUES; SIGNAL INTEGRITY;

MOBILE TELECOMMUNICATION SYSTEMS;

EID: 3042780494     PISSN: 15361233     EISSN: None     Source Type: Journal    
DOI: 10.1109/TMC.2003.1217237     Document Type: Article

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