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Volumn 43, Issue 9 AB, 2004, Pages
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Effects of HfOxNy gate-dielectric nitrogen concentration on the charge trapping properties of metal-oxide-semiconductor devices
a a a a |
Author keywords
Charge trapping; Hafnium oxynitride; Metal oxide semiconductor (MOS); Nitrogen concentration; Stress induced leakage current (SILC)
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Indexed keywords
CAPACITORS;
CRYSTAL DEFECTS;
DIELECTRIC DEVICES;
ELECTRIC POTENTIAL;
ELECTRON TRAPS;
LEAKAGE CURRENTS;
NITROGEN;
RAPID THERMAL ANNEALING;
STRAIN RATE;
CHARGE TRAPPING;
HAFNIUM OXYNITRIDE;
NITROGEN CONCENTRATION;
STRESS-INDUCED LEAKAGE CURRENT (SILC);
MOS DEVICES;
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EID: 9144274053
PISSN: 00214922
EISSN: None
Source Type: Journal
DOI: 10.1143/JJAP.43.L1181 Document Type: Article |
Times cited : (2)
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References (16)
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