Metallic Nanoparticle Based Interconnect for Heterogeneous 3D Integration

Proceedings - Electronic Components and Technology Conference

Volumn 2016-August, Issue , 2016, Pages 217-224

  Van Zeijl, H W ^a   Carisey, Y ^b,c   Damian, A ^b,d   Poelma, R H ^b   Zinn, A ^e   Zhang, C Q ^b  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^b DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

^c Currently at Amadeus IT Group   (France)

^d NXP SEMICONDUCTORS   (Netherlands)

^e LOCKHEED MARTIN SPACE SYSTEMS COMPANY   (United States)

Author keywords

3D integration; Copper interconnect; Low Temperature sintering; Metallic nanoparticle paste

Indexed keywords

BONDING; CONTACT RESISTANCE; COPPER; IN SITU PROCESSING; INTEGRATION; NANOPARTICLES; NETWORK COMPONENTS; PROCESSING; SINTERING; TEMPERATURE; THREE DIMENSIONAL INTEGRATED CIRCUITS; WAFER BONDING;

3-D INTEGRATION; 3D HETEROGENEOUS INTEGRATION; COPPER INTERCONNECTS; ELECTRICAL MEASUREMENT; LOW-TEMPERATURE SINTERING; METALLIC NANOPARTICLES; PROCESSING TEMPERATURE; SPECIFIC CONTACT RESISTANCES;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84987845541     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2016.314     Document Type: Conference Paper

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