The characteristics of Cu nanopaste sintered by atmospheric-pressure plasma

Microelectronic Engineering

Volumn 107, Issue , 2013, Pages 121-124

  Kim, Kwang Seok ^a   Bang, Jae Oh ^b   Choa, Yong Ho ^c   Jung, Seung Boo ^b  

^a Sungkyunkwan University   (South Korea)

^b Sungkyunkwan University   (South Korea)

^c Hanyang University   (South Korea)

Author keywords

Atmospheric pressure plasma; Copper nanopaste; Plasma sintering; Screen printing

Indexed keywords

ATMOSPHERIC PRESSURE; COPPER; ELECTRONIC EQUIPMENT; FLEXIBLE ELECTRONICS; SCREEN PRINTING; THERMOELECTRIC EQUIPMENT;

ATMOSPHERIC PRESSURE PLASMAS; CONVENTIONAL HEATING; FLEXIBLE ELECTRONIC DEVICES; LOWER TEMPERATURES; OXYGEN CONCENTRATIONS; PATTERN SURFACES; PLASMA SINTERING; RADIATION CONDUCTION;

SINTERING;

EID: 84891466834     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2012.08.019     Document Type: Article

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