Nanocopper based solder-free electronic assembly material

Technical Proceedings of the 2012 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2012

Volumn , Issue , 2012, Pages 71-74

  Zinn, A A ^a   Stoltenberg, R M ^a   Fried, A T ^a   Chang, J ^a   Elhawary, A ^a   Beddow, J ^a   Chiu, F ^a  

^a LOCKHEED MARTIN SPACE SYSTEMS COMPANY   (United States)

Author keywords

Lead free solder; Nanocopper; Solder free electronics

Indexed keywords

ADVANCED TECHNOLOGY; CHEMICAL REDUCTION; CMOS SENSORS; CU NANOPARTICLES; ELECTRICAL INTERCONNECTS; ELECTRONIC ASSEMBLIES; FUSED MATERIALS; LEAD FREE SOLDERS; LOCKHEED MARTIN SPACE SYSTEMS; NANO COPPER; NANOMATERIAL; SCALABLE SYNTHESIS; SURFACTANT MIXTURE; TIN/LEAD SOLDERS; XRD;

CMOS INTEGRATED CIRCUITS; EXHIBITIONS; FABRICATION; FLUIDICS; NANOPARTICLES; SURFACE ACTIVE AGENTS;

NANOTECHNOLOGY;

EID: 84864915265     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. "Directive 2011/65/EU on the restriction of the use of certain hazardous substances in electrical and electronic equipment," Official Journal of the European Union, 2011.
2. "The Lead Free Electronics Manhattan Project - Phase I," Department of the Navy, Science & Technology, 2009, https://acc.dau.mil/ leadfree.
3. "Lead Free and Green Electronics Forum," Center for Advanced Life Cycle Engineering, University of Maryland, 2011.
4. Borgesen P., Bieler T., Lehman L. P., Cotts E. J., "Pb-free solder: Mew materials considerations for microelectronics processing," MRS Bulletin, 32, pp. 360-365, 2007.
5. This information, tin whisker images, and much more can be found at the following NASA website http://nepp.nasa.gove/whisker/failures/index.htm
6. Frederickson, M., Morris, E., "Pb-free Electronics Research Manhattan Project Overview," LMC Defense Manufacturing Conference, Nov 30 - Dec 3, 2009.