Ink-jet printing of Cu conductive ink on flexible substrate modified by oxygen plasma treatment

Surface and Coatings Technology

Volumn 205, Issue SUPPL. 1, 2010, Pages

  Goo, Yong Sung ^a   Lee, Young In ^a   Kim, Namwoo ^a   Lee, Kun Jae ^a   Yoo, Bongyoung ^a   Hong, Sung Jei ^b   Kim, Joong Do ^c   Choa, Yong Ho ^a  

^a Hanyang University   (South Korea)

^b Korea Electronic Technology Institute (KETI)   (South Korea)

^c Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Conductive ink; Plasma; Printing; Surface modification

Indexed keywords

CONDUCTIVE INK; CONDUCTIVE LINES; CONDUCTIVE PATTERNS; CU COMPLEXES; ELECTRICAL CONDUCTIVITY; FIELD EMISSION SCANNING ELECTRON MICROSCOPES; FLEXIBLE SUBSTRATE; FOUR-POINT PROBE; NON-CONTACT; OPTICAL MICROSCOPES; OXYGEN PLASMA TREATMENTS; PI FILM; PLASMA TREATMENT; SINTERED MICROSTRUCTURE; SUBSTRATE SURFACE; SURFACE MODIFICATION; THERMAL TREATMENT; X RAY DIFFRACTOMETERS;

CONDUCTIVE FILMS; CONTACT ANGLE; COPPER; COPPER COMPOUNDS; CRYSTAL MICROSTRUCTURE; ELECTRIC CONDUCTIVITY; FIELD EMISSION; INK; MICROSCOPES; OXYGEN; PLASMA APPLICATIONS; PLASMAS; POLYIMIDES; SCANNING ELECTRON MICROSCOPY; SINTERING; SUBSTRATES; SURFACE PROPERTIES; THREE DIMENSIONAL;

INK JET PRINTING;

EID: 78649940483     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2010.08.039     Document Type: Article

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