-
3
-
-
84994313498
-
-
G. Davy, private communication (October 2014); quoted in Ref. 9
-
G. Davy, private communication (October 2014); quoted in Ref. 9.
-
-
-
-
4
-
-
84876907903
-
-
edited by K. Suganuma (Marcel Dekker, Inc.)
-
Y. Zhang, in Soldering in Electronics, edited by K. Suganuma (Marcel Dekker, Inc., 2004), p. 121.
-
(2004)
Soldering in Electronics
, pp. 121
-
-
Zhang, Y.1
-
5
-
-
84934900802
-
-
edited by D. Shangguan (ASM International)
-
K. N. Tu, J. O. Suh, and A. T. Wu, in Lead-Free Solder Interconnect Reliability, edited by D. Shangguan (ASM International, 2005), p. 851.
-
(2005)
Lead-Free Solder Interconnect Reliability
, pp. 851
-
-
Tu, K.N.1
Suh, J.O.2
Wu, A.T.3
-
6
-
-
84885592716
-
-
D. Bunyan, M. A. Ashworth, G. D. Wilcox, R. L. Higginson, R. J. Heath, and C. Liu, Trans. Inst. Met. Finish. 91, 249-259 (2013).
-
(2013)
Trans. Inst. Met. Finish.
, vol.91
, pp. 249-259
-
-
Bunyan, D.1
Ashworth, M.A.2
Wilcox, G.D.3
Higginson, R.L.4
Heath, R.J.5
Liu, C.6
-
8
-
-
84948451503
-
-
J. R. Barnes, "Bibliography for Tin Whiskers, Zinc Whiskers, Cadmium Whiskers, Indium Whiskers, and Other Conductive Metal and Semiconductor Whiskers," see http://www.dbicorporation.com/whiskbib.htm.
-
Bibliography for Tin Whiskers, Zinc Whiskers, Cadmium Whiskers, Indium Whiskers, and Other Conductive Metal and Semiconductor Whiskers
-
-
Barnes, J.R.1
-
10
-
-
84923786713
-
-
V. G. Karpov, SMT Mag. 30, 28 (2015), see http://iconnect007.uberflip.com/i/455818/44.
-
(2015)
SMT Mag.
, vol.30
, pp. 28
-
-
Karpov, V.G.1
-
12
-
-
84910595854
-
-
M. Umalas, S. Vlassov, B. Polyakov, L. M. Dorogin, R. Saar, I. Kink, R. Lohmus, A. Lohmus, and A. E. Romanov, J. Cryst. Growth 410, 63 (2015).
-
(2015)
J. Cryst. Growth
, vol.410
, pp. 63
-
-
Umalas, M.1
Vlassov, S.2
Polyakov, B.3
Dorogin, L.M.4
Saar, R.5
Kink, I.6
Lohmus, R.7
Lohmus, A.8
Romanov, A.E.9
-
13
-
-
3142567371
-
-
S. H. Liu, C. Chen, P. C. Liu, and T. Chou, J. Appl. Phys. 95, 7742 (2004).
-
(2004)
J. Appl. Phys.
, vol.95
, pp. 7742
-
-
Liu, S.H.1
Chen, C.2
Liu, P.C.3
Chou, T.4
-
14
-
-
84994313452
-
-
Ph.D. thesis, Auburn, Alabama
-
E. R. Crandall, Ph.D. thesis, Auburn, Alabama, 2012, see http://ldfcoatings.com/articles/ErikaCrandall.pdf.
-
(2012)
-
-
Crandall, E.R.1
-
16
-
-
84994367033
-
SERDP tin whisker testing and modeling: Thermal cycling testing
-
Raleigh, NC, 29 October
-
S. Meschter, P. Snugovsky, J. Kennedy, Z. Bagheri, and E. Kosiba, "SERDP tin whisker testing and modeling: Thermal cycling testing," in 8th CALCE/IPC International Tin Whisker Symposium, Raleigh, NC, 29 October 2014, see http://www.calce.umd.edu/calce-enews/2014/8thInternationalSymposiumOnTinWhiskers.htm.
-
(2014)
8th CALCE/IPC International Tin Whisker Symposium
-
-
Meschter, S.1
Snugovsky, P.2
Kennedy, J.3
Bagheri, Z.4
Kosiba, E.5
-
18
-
-
84994245347
-
-
M.S. thesis, University of Maryland
-
L. Panashchenko, M.S. thesis, University of Maryland, 2009, see http://hdl.handle.net/1903/10021.
-
(2009)
-
-
Panashchenko, L.1
-
19
-
-
84877131256
-
-
D. Susan, J. Michael, R. P. Grant, B. McKenzie, and W. G. Yelton, Metall. Mater. Trans. A 44, 1485 (2013).
-
(2013)
Metall. Mater. Trans. A
, vol.44
, pp. 1485
-
-
Susan, D.1
Michael, J.2
Grant, R.P.3
McKenzie, B.4
Yelton, W.G.5
-
20
-
-
77951611429
-
-
J. Cheng, S. Chen, P. T. Vianco, and J. C. M. Li, J. Appl. Phys. 107, 074902 (2010).
-
(2010)
J. Appl. Phys.
, vol.107
-
-
Cheng, J.1
Chen, S.2
Vianco, P.T.3
Li, J.C.M.4
-
21
-
-
78650718788
-
-
J. Cheng, S. Chen, P. T. Vianco, J. Subjeck, and J. C. M. Li, J. Mater. Sci. 46, 263 (2011).
-
(2011)
J. Mater. Sci.
, vol.46
, pp. 263
-
-
Cheng, J.1
Chen, S.2
Vianco, P.T.3
Subjeck, J.4
Li, J.C.M.5
-
22
-
-
65349159154
-
-
J. R. Dennison, J. Gillespie, J. Hodges, R. C. Hoffmann, J. Abbott, S. Hart, and A. W. Hunt, AIP Conf. Proc. 1099, 203 (2009).
-
(2009)
AIP Conf. Proc.
, vol.1099
, pp. 203
-
-
Dennison, J.R.1
Gillespie, J.2
Hodges, J.3
Hoffmann, R.C.4
Abbott, J.5
Hart, S.6
Hunt, A.W.7
-
27
-
-
33745249947
-
-
M. Touzin, D. Goeuriot, C. Guerret-Piecourt, D. Juve, and D. Treheux, J. Appl. Phys. 99, 114110 (2006).
-
(2006)
J. Appl. Phys.
, vol.99
-
-
Touzin, M.1
Goeuriot, D.2
Guerret-Piecourt, C.3
Juve, D.4
Treheux, D.5
-
28
-
-
0037113028
-
-
Y. Mizuhara, J. Kato, T. Nagatomi, and Y. Takai, J. Appl. Phys. 92, 6128 (2002).
-
(2002)
J. Appl. Phys.
, vol.92
, pp. 6128
-
-
Mizuhara, Y.1
Kato, J.2
Nagatomi, T.3
Takai, Y.4
-
29
-
-
84898439332
-
-
G. Wilson, J. R. Dennison, A. Evans, and J. Dekany, IEEE Trans. Plasma Sci. 41, 3536 (2013).
-
(2013)
IEEE Trans. Plasma Sci.
, vol.41
, pp. 3536
-
-
Wilson, G.1
Dennison, J.R.2
Evans, A.3
Dekany, J.4
-
31
-
-
84994328711
-
-
R. Irving and S. Federman, private communication (November 2015)
-
R. Irving and S. Federman, private communication (November 2015).
-
-
-
-
34
-
-
84920771130
-
-
J. Stein, U. Welzel, A. Leineweber, W. Huegelb, and E. J. Mittemeijer, Acta Mater. 86, 102 (2015).
-
(2015)
Acta Mater.
, vol.86
, pp. 102
-
-
Stein, J.1
Welzel, U.2
Leineweber, A.3
Huegelb, W.4
Mittemeijer, E.J.5
-
35
-
-
66749102617
-
-
M. Sobiech, M. Wohlschlögel, U. Welzel, E. J. Mittemeijer, W. Hügel, A. Seekamp, W. Liu, and G. E. Ice, Appl. Phys. Lett. 94, 221901 (2009).
-
(2009)
Appl. Phys. Lett.
, vol.94
-
-
Sobiech, M.1
Wohlschlögel, M.2
Welzel, U.3
Mittemeijer, E.J.4
Hügel, W.5
Seekamp, A.6
Liu, W.7
Ice, G.E.8
-
36
-
-
84940896459
-
-
J. Chang, S. K. Kang, J.-H. Lee, K.-S. Kim, and H. M. Lee, J. Electron. Mater. 44, 3486-3499 (2015).
-
(2015)
J. Electron. Mater.
, vol.44
, pp. 3486-3499
-
-
Chang, J.1
Kang, S.K.2
Lee, J.-H.3
Kim, K.-S.4
Lee, H.M.5
-
37
-
-
84940794561
-
-
P. Vianco, M. Neilsen, J. Rejent, and R. Grant, J. Electron. Mater. 44, 4012-4034 (2015).
-
(2015)
J. Electron. Mater.
, vol.44
, pp. 4012-4034
-
-
Vianco, P.1
Neilsen, M.2
Rejent, J.3
Grant, R.4
|