Modeling and characterization of Cu-graphene heterogeneous interconnects

IEEE-NANO 2015 - 15th International Conference on Nanotechnology

Volumn , Issue , 2015, Pages 499-502

  Wang, Da Wei ^a   Zhang, Rui ^a   Yin, Wen Yan ^a   Zhao, Wen Sheng ^b   Wang, Gaofeng ^b  

^a ZHEJIANG UNIVERSITY   (China)

^b HANGZHOU DIANZI UNIVERSITY   (China)

Author keywords

Cu graphene heterogeneous interconnect; electrical modeling; electrothermal response; equivalent circuit model; time domain finite element method (TD FEM)

Indexed keywords

CIRCUIT SIMULATION; CIRCUIT THEORY; EQUIVALENT CIRCUITS; GRAPHENE; NANOTECHNOLOGY; RECONFIGURABLE HARDWARE; TIME DOMAIN ANALYSIS;

ELECTRICAL MODELING; ELECTROTHERMAL CHARACTERIZATION; ELECTROTHERMAL RESPONSE; EQUIVALENT CIRCUIT MODEL; FEM ALGORITHMS; INTERFACIAL RESISTANCES; PERFORMANCE AND RELIABILITIES; TIME-DOMAIN FINITE ELEMENT METHODS;

FINITE ELEMENT METHOD;

EID: 84964318815     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/NANO.2015.7388648     Document Type: Conference Paper

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