Development of green CMP by slurry reduction through controlling platen coolant temperature

International Journal of Precision Engineering and Manufacturing - Green Technology

Volumn 2, Issue 4, 2015, Pages 339-344

  Yuh, Minjong ^a   Jang, Soocheon ^a   Kim, Hyoungjae ^b   Lee, Hyunseop ^c   Jeong, Haedo ^a  

^a Pusan National University   (South Korea)

^b Korea Institute of Industrial Technology   (South Korea)

^c Tongmyong University   (South Korea)

Author keywords

Chemical mechanical polishing (CMP); Copper (Cu); Oscar Type polisher; Printed circuit board (PCB)

Indexed keywords

COOLANTS; COPPER DEPOSITS; POLISHING; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE;

CHEMICAL MECHANICAL POLISHING(CMP); COOLANT TEMPERATURE; GLOBAL PLANARIZATIONS; MANUFACTURING PROCESS; MECHANICAL POLISHING; OSCAR-TYPE POLISHER; PRINTED CIRCUIT BOARDS (PCB); THERMOCHEMICAL REACTIONS;

CHEMICAL MECHANICAL POLISHING;

EID: 84943771490     PISSN: 22886206     EISSN: 21980810     Source Type: Journal    
DOI: 10.1007/s40684-015-0041-8     Document Type: Article

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