Effects of slurry flow rate and pad conditioning temperature on dishing, erosion, and metal loss during copper CMP

Journal of the Electrochemical Society

Volumn 153, Issue 5, 2006, Pages

  Mudhivarthi, Subrahamanya ^a,b   Gitis, Norm ^c   Kuiry, Suresh ^c   Vinogradov, Michael ^c   Kumar, Ashok ^a,b,d  

^a University of South Florida   (United States)

^b UNIVERSITY OF SOUTH FLORIDA   (United States)

^c Center for Tribology Inc   (United States)

^d ELECTROCHEMICAL SOCIETY

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; COPPER; DEFECTS; IMAGING TECHNIQUES; SLURRIES; TRIBOLOGY;

AUTOMATIC MULTISCAN IMAGING; DISHING; PLANARITY DEFECTS;

EROSION;

EID: 33645689911     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.2177007     Document Type: Article

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