Hybrid stacking structure of electroplated copper onto graphene for future interconnect applications

Applied Physics Letters

Volumn 107, Issue 9, 2015, Pages

  Su, Ya Wen ^a   Wu, Cen Shawn ^b   Liu, Chih Hua ^b   Lin, Hung Yi ^c   Chen, Chii Dong ^d  

^a NATIONAL APPLIED RESEARCH LABORATORIES   (Taiwan)

^b NATIONAL CHANGHUA UNIVERSITY OF EDUCATION   (Taiwan)

^c NATIONAL UNIVERSITY OF TAINAN   (Taiwan)

^d INSTITUTE OF PHYSICS   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROPLATING; GRAPHENE; HYBRID SYSTEMS;

COPPER ELECTROPLATING; ELECTROPLATED COPPER; ELECTROPLATING PROCESS; INTERCONNECT APPLICATIONS; INTERMIXING LAYER; SEMICONDUCTOR FABRICATION TECHNOLOGY; STACKING STRUCTURES; THERMAL-ANNEALING;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84940830304     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.4930154     Document Type: Article

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