Silicon technologies and solutions for the data-driven world

Digest of Technical Papers - IEEE International Solid-State Circuits Conference

Volumn 58, Issue , 2015, Pages 8-14

  Kim, Kinam ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

DIGITAL DEVICES; ELECTRONICS PACKAGING; SILICON;

ELECTRONICS SYSTEM; FEATURE SIZES; HIGH PERFORMANCE DEVICES; HUMAN SOCIETY; INFORMATION REVOLUTION; PERFORMANCE ENHANCING; SILICON TECHNOLOGIES; THROUGH SILICON VIAS;

THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 84940771365     PISSN: 01936530     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSCC.2015.7062845     Document Type: Conference Paper

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