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Volumn 113, Issue , 2015, Pages 116-120

Flexible and stretchable electronics for wearable health devices

Author keywords

Flexible electronics; Stretchable electronics

Indexed keywords

WEARABLE TECHNOLOGY;

EID: 84937516431     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sse.2015.05.024     Document Type: Article
Times cited : (108)

References (13)
  • 1
    • 38849187155 scopus 로고    scopus 로고
    • Inkjet printing of narrow conductive tracks on untreated polymeric substrates
    • T.H.J. van Osch, J. Perelaer, A.W.M. de Laat, and U.S. Schubert Inkjet printing of narrow conductive tracks on untreated polymeric substrates Adv Mater 20 2008 343 345
    • (2008) Adv Mater , vol.20 , pp. 343-345
    • Van Osch, T.H.J.1    Perelaer, J.2    De Laat, A.W.M.3    Schubert, U.S.4
  • 9
    • 84873474632 scopus 로고    scopus 로고
    • Stretchable electronics technology for large area applications: Fabrication and mechanical characterization
    • F. Bossuyt, T. Vervust, and J. Vanfleteren Stretchable electronics technology for large area applications: fabrication and mechanical characterization IEEE Trans Compon Pack Manuf Technol 3 2013 229 235
    • (2013) IEEE Trans Compon Pack Manuf Technol , vol.3 , pp. 229-235
    • Bossuyt, F.1    Vervust, T.2    Vanfleteren, J.3
  • 10
    • 77950214388 scopus 로고    scopus 로고
    • Materials and mechanics for stretchable electronics
    • J.A. Rogers, T. Someya, and Y. Huang Materials and mechanics for stretchable electronics Science 327 2010 1603 1607
    • (2010) Science , vol.327 , pp. 1603-1607
    • Rogers, J.A.1    Someya, T.2    Huang, Y.3
  • 12
    • 79960841549 scopus 로고    scopus 로고
    • Polyimide-enhanced stretchable interconnects: Design, fabrication, and characterization
    • H. Yung-Yu, M. Gonzalez, F. Bossuyt, J. Vanfleteren, and I. De Wolf Polyimide-enhanced stretchable interconnects: design, fabrication, and characterization IEEE Trans Electron Dev 58 2011 2680 2688
    • (2011) IEEE Trans Electron Dev , vol.58 , pp. 2680-2688
    • Yung-Yu, H.1    Gonzalez, M.2    Bossuyt, F.3    Vanfleteren, J.4    De Wolf, I.5
  • 13
    • 78751645105 scopus 로고    scopus 로고
    • The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects
    • Jan
    • Y.Y. Hsu, M. Gonzalez, F. Bossuyt, F. Axisa, J. Vanfleteren, and I. De Wolf The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects Thin Solid Films 519 Jan 2011 2225 2234
    • (2011) Thin Solid Films , vol.519 , pp. 2225-2234
    • Hsu, Y.Y.1    Gonzalez, M.2    Bossuyt, F.3    Axisa, F.4    Vanfleteren, J.5    De Wolf, I.6


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.