High curvature bending characterization of ultra-thin chips and chip-on-foil assemblies

EMPC 2013 - European Microelectronics Packaging Conference: The Winding Roads of Electronics Packaging

Volumn , Issue , 2013, Pages

  Van Den Ende, Daan ^a   Verhoeven, Frits ^b   Van Der Eijnden, Pepijn ^b   Kusters, Roel ^a   Sridhar, Ashok ^a   Cauwe, Maarten ^c   Van Den Brand, Jeroen ^a  

^a HOLST CENTRE   (Netherlands)

^b TNO   (Netherlands)

^c IMEC   (Belgium)

Author keywords

flexible electronics; four point bending; high curvature mechanical bending; PET foil; Polyester foil; Ultra thin chip

Indexed keywords

BENDING DIRECTIONS; FOUR-POINT BENDING; FOUR-POINT BENDING METHOD; INTEGRATION TECHNIQUES; LARGE AREA DEVICES; MECHANICAL BENDING; POLYESTER FOIL; ULTRA-THIN CHIPS;

BENDING STRENGTH; COSTS; FLEXIBLE ELECTRONICS; MICROELECTRONICS; SILICON;

CHIP SCALE PACKAGES;

EID: 84893250450     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

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7. nd Electronic Components and Technology Conference, ECTC 2012; pp238-244, 2012.
8. W. A. MacDonald et al. "Latest advances in substrates for flexible electronics", J. Soc. Inf. Display 15 (2007) 1075-1083