Polyimide-enhanced stretchable interconnects: Design, fabrication, and characterization

IEEE Transactions on Electron Devices

Volumn 58, Issue 8, 2011, Pages 2680-2688

  Hsu, Yung Yu ^a,b   Gonzalez, Mario ^a   Bossuyt, Frederick ^a   Vanfleteren, Jan ^a   De Wolf, Ingrid ^a,b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

Design for experiments; design optimization; failure analysis; finite element methods; flexible electronics; integrated circuit interconnections; integrated circuit packaging; materials reliability; strain; stress

Indexed keywords

DESIGN FOR EXPERIMENTS; DESIGN GUIDELINES; DESIGN OPTIMIZATION; DESIGN PARAMETERS; ELECTRICAL INTERCONNECTIONS; EXPERIMENTAL OBSERVATION; FATIGUE LIFETIME; FINITE ELEMENT MODELING; IN-SITU; INTEGRATED CIRCUIT INTERCONNECTIONS; INTEGRATED CIRCUIT PACKAGING; MATERIAL SELECTION; OPTIMAL DESIGN; OPTIMIZED DESIGNS;

CMOS INTEGRATED CIRCUITS; ELONGATION; EXPERIMENTS; FAILURE ANALYSIS; FINITE ELEMENT METHOD; FLEXIBLE ELECTRONICS; INTEGRATED CIRCUITS; INTEGRATION; OPTIMAL SYSTEMS; OPTIMIZATION; POLYIMIDES;

DESIGN;

EID: 79960841549     PISSN: 00189383     EISSN: None     Source Type: Journal    
DOI: 10.1109/TED.2011.2147789     Document Type: Article

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