Novel interconnect methodologies for ultra-thin chips on foils

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2012, Pages 238-244

  Sridhar, A ^a   Cauwe, M ^b   Fledderus, H ^a   Kusters, R H L ^a   Van Den Brand, J ^a  

^a HOLST CENTRE   (Netherlands)

^b IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL CONDUCTIVITY; EXPERIMENTAL INVESTIGATIONS; INTEGRATION APPROACH; INTERCONNECT RELIABILITY; INTERCONNECTION TECHNOLOGY; LASER SCRIBING; LASER-INDUCED FORWARD TRANSFER; MICROELECTRONIC SYSTEMS; PRACTICAL IMPLEMENTATION; PRINTED ELECTRONICS; ROLL TO ROLL; SILICON TECHNOLOGIES; STANDARD TECHNOLOGY; ULTRA-THIN CHIPS; VIA FILLING;

ELECTRIC CONDUCTIVITY; MICROELECTRONICS;

TECHNOLOGY;

EID: 84866853919     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2012.6248834     Document Type: Conference Paper

References (9)

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2. Burghartz, J.N. et al, "Ultra-thin Chip Technology and Applications, a New Paradigm in Silicon Technology," Solid-State Electronics, Vol. 54, (2010), pp. 818-829.
3. Chip2Foil - EU Project (www.chip2foil.eu); retrieved on 01/03/2012.
4. th International Symposium on Flexible Organic Electronics - ISFOE11, Thessaloniki, Greece, July 2011.
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6. Kipphan, H., Handbook of Print Media, Springer-Verlag (Berlin-Heidelberg, 2001), pp. 711-722.
7. Perelaer, J., Microstructures Prepared via Inkjet Printing and Embossing Techniques, PhD Thesis, Eindhoven University of Technology (Eindhoven, the Netherlands, 2009), pp. 2-10.
8. Banks, D.P. et al, "Triazene Photopolymer Dynamic Release Layer-assisted Femtosecond Laser-induced Forward Transfer with an Active Carrier Substrate", Europhysics Letters, Vol. 83, No. 3, (2008).
9. Yamada, H. et al, "Optimization of Laser-induced Forward Transfer Process of Metal Thin Films", Applied Surface Science, Vol. 197-198, (2002), pp. 411-415.