A chip embedding solution based on low-cost plastic materials as enabling technology for smart labels

2012 4th Electronic System-Integration Technology Conference, ESTC 2012

Volumn , Issue , 2012, Pages

  Cauwe, Maarten ^a   Vandecasteele, Bjorn ^a   De Baets, Johan ^a   Van Den Brand, Jeroen ^b   Kusters, Roel ^b   Sridhar, Ashok ^b  

^a IMEC   (Belgium)

^b HOLST CENTRE   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

COSTS; ELECTRONICS ENGINEERING; LABELS;

CURRENT TECHNOLOGY; ENABLING TECHNOLOGIES; LOW-COST PLASTICS; PROCESS FLOWS; SMART PACKAGING; SMART SENSING; TECHNOLOGY-BASED; VIA INTERCONNECTION;

TECHNOLOGY;

EID: 84902440718     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2012.6542155     Document Type: Conference Paper

References (8)

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