The effects of encapsulation on deformation behavior and failure mechanisms of stretchable interconnects

Thin Solid Films

Volumn 519, Issue 7, 2011, Pages 2225-2234

  Hsu, Yung Yu ^a,b   Gonzalez, Mario ^a   Bossuyt, Frederick ^a   Axisa, Fabrice ^a   Vanfleteren, Jan ^a   De Wolf, Ingrid ^a,b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

Cohesive failure; Interfacial delamination; Stretchable device

Indexed keywords

COHESIVE FAILURES; DEFORMATION BEHAVIOR; DELAMINATION FAILURE; EFFECT OF ENCAPSULATION; ENCAPSULATION LAYER; EXPERIMENTAL OBSERVATION; FAILURE MECHANISM; IN-PLANE; IN-PLANE SHEAR; IN-SITU; INTERFACIAL DELAMINATION; MECHANICAL ANALYSIS; METAL CONDUCTOR; NUMERICAL MODELING; NUMERICAL RESULTS; NUMERICAL SIMULATION; OPTICAL IMAGE; OUT-OF-PLANE; PERCENTAGE ELONGATION; PLASTIC STRAIN; SCANNING ELECTRON MICROGRAPHS; STRETCHABLE DEVICE; STRETCHING PROCESS;

DEFORMATION; DELAMINATION; DIRECTIONAL PATTERNS (ANTENNA); EXPERIMENTS; GEOMETRICAL OPTICS; NUMERICAL ANALYSIS; SCANNING ELECTRON MICROSCOPY; SHEAR STRAIN; STEEL SHEET;

METALS;

EID: 78751645105     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2010.10.069     Document Type: Article

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