An energy efficient multi-bit TSV transmitter using capacitive coupling

2014 21st IEEE International Conference on Electronics, Circuits and Systems, ICECS 2014

Volumn , Issue , 2014, Pages 650-653

  Görner, Johannes ^a   Höppner, Sebastian ^a   Walter, Dennis ^a   Haas, Michael ^a   Plettemeier, Dirk ^a   Schüffny, René ^a  

^a DRESDEN UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; CHIP SCALE PACKAGES; CIRCUIT SIMULATION; ENERGY EFFICIENCY; INTEGRATED CIRCUIT INTERCONNECTS; SUBSTRATES; THREE DIMENSIONAL INTEGRATED CIRCUITS;

BULK SUBSTRATES; CAPACITIVE COUPLINGS; ENERGY EFFICIENT; HIGH-SPEED SERIAL; IN-CHIP; LOW VOLTAGE SWINGS; MULTI-BITS; POINT-TO-POINT LINK; SIGNAL CHANNELS; THROUGH SILICON VIAS;

TRANSMITTERS;

EID: 84925436749     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICECS.2014.7050069     Document Type: Conference Paper

References (7)

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