Fabrication of a Ni-Cu thin film material library using pulsed electrodeposition

Journal of the Electrochemical Society

Volumn 161, Issue 10, 2014, Pages

  Srinivas, Palli ^a   Hamann, Sven ^b   Wambach, Matthias ^b   Ludwig, Alfred ^b   Dey, Suhash R ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY HYDERABAD   (India)

^b RUHR UNIVERSITY BOCHUM   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYING; COPPER ALLOYS; ELECTRODEPOSITION; SCANNING ELECTRON MICROSCOPY; THIN FILMS; X RAY DIFFRACTION; X RAY SPECTROSCOPY;

CRYSTALLOGRAPHIC STRUCTURE; ELECTRODEPOSITION TECHNIQUE; ENERGY DISPERSIVE X RAY SPECTROSCOPY; LATERAL POSITIONS; MATERIALS LIBRARIES; PULSED ELECTRODEPOSITION; THIN FILM COMPOSITION; THIN FILM MATERIAL;

NICKEL;

EID: 84923896421     PISSN: 00134651     EISSN: 19457111     Source Type: Journal    
DOI: 10.1149/2.0451410jes     Document Type: Article

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