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Journal of Applied Electrochemistry

Volumn 39, Issue 12, 2009, Pages 2337-2344

Copper-nickel codeposition as a model for mass-transfer characterization in copper-indium-selenium thin-film production

(6) Ollivier, A a,b Muhr, L b Delbos, S a Grand, P P a Matlosz, M b Chassaing, E a

a CNRS (France)

b UNIVERSITÉ DE LORRAINE (France)

Author keywords

Alloy electrodeposition; Hydrodynamics; Mass transfer; Process scale up

Indexed keywords

ACTIVE SPECIES; ALLOY ELECTRODEPOSITION; CODEPOSITION; CODEPOSITION SYSTEM; COMPOSITION DISTRIBUTIONS; COPPER DEPOSITION; DEPOSIT THICKNESS; ELECTRODEPOSITION PROCESS; EXPERIMENTAL COMPARISON; MASS TRANSFER CONTROL; MASS-TRANSFER PROCESS; MODEL SYSTEM; NEUTRAL PH; PROCESS DEVELOPMENT; TRANSFER CHARACTERISTICS;

COPPER ALLOYS; ELECTRODEPOSITION; FLUID DYNAMICS; HYDRODYNAMICS; INDIUM; MASS TRANSFER; NICKEL; NICKEL ALLOYS; SELENIUM; SEMICONDUCTING SELENIUM COMPOUNDS;

COPPER;

EID: 70849117263 PISSN: 0021891X EISSN: None Source Type: Journal
DOI: 10.1007/s10800-009-9918-y Document Type: Article

Times cited : (14)

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