Electrodeposition and characterization of Cu-Ni-Zn and Cu-Ni-Cd alloys

Electrochimica Acta

Volumn 50, Issue 14, 2005, Pages 2857-2864

  El Chiekh, F ^a   El Haty, M T ^b   Minoura, H ^c   Montaser, A A ^b  

^a SOHAG UNIVERSITY   (Egypt)

^b ASWAN UNIVERSITY   (Egypt)

^c GIFU UNIVERSITY   (Japan)

Author keywords

Alloy composition; Current density; Electrodeposition; Morphology; Ternary alloys

Indexed keywords

CONCENTRATION (PROCESS); COPPER ALLOYS; CURRENT DENSITY; ELECTRODEPOSITION; ELECTROLYTES; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; X RAY DIFFRACTION ANALYSIS;

ALLOY COMPOSITION; GLASS CELL; SURFACE ACTIVE SUBSTANCE (SAS); TERNARY ALLOYS;

TERNARY SYSTEMS;

EID: 17444398197     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2004.11.033     Document Type: Article

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