Development of Ni-Cu materials library by using combinatorial pulsed electrodeposition

Transactions of the Indian Institute of Metals

Volumn 66, Issue 4, 2013, Pages 429-432

  Srinivas, P ^a   Hamann, Sven ^b   Wambach, Matthias ^b   Kieschnick, Michael ^b   Ludwig, Alfred ^b   Dey, Suhash R ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY HYDERABAD   (India)

^b RUHR UNIVERSITY BOCHUM   (Germany)

Author keywords

Combinatorial approach; Ni Cu alloys; Pulsed electrodeposition; XRD and EDX

Indexed keywords

EID: 84879622165     PISSN: 09722815     EISSN: 09751645     Source Type: Journal    
DOI: 10.1007/s12666-013-0249-7     Document Type: Article

References (10)

1. Amis EJ, Xiang X-D, Zhao J-C, MRS Bull 27 (2002) 295.
2. Beattie SD and Dahn JR, J Electrochem Soc 150 (2003) C802.
3. Beattie SD and Dahn JR, J Electrochem Soc 150 (2003) C457.
4. Beattie SD and Dahn JR, J Electrochem Soc 152 (2005) C549.
5. Ying RY, J electrochem Soc 135 (1988) 2957.
6. Roy S, Matlosz M, Landolt D, J Electrochem Soc 141 (1994) 1509.
7. Baskaran I, Narayanan TSNS, Stephen A, Mater Lett 60 (2006) 1990.
8. Ghosh SK, Grover AK, Dey GK and Totlani MK, Surf Coat Technol 126 (2000) 48.
9. Nash P, Phase Diagrams of Binary Nickel Alloys, ASM, Materials Park, (1991) p 85.
10. Fabri Miranda FJ, Barcia E, Mattos OR and Wiart R, J Electrochem Soc 144 (1997) 3449.