Developing plating baths for the production of reflective Ni-Cu films

Electrochimica Acta

Volumn 62, Issue , 2012, Pages 381-389

  Calleja, P ^a   Esteve, J ^a   Cojocaru, P ^b   Magagnin, L ^b   Valles E ^a   Gomez E ^a  

^a UNIVERSITY OF BARCELONA   (Spain)

^b POLITECNICO DI MILANO   (Italy)

Author keywords

Electrodeposition; Gloss; Ni Cu alloy; Reflectivity

Indexed keywords

APPLIED POTENTIALS; COMPLEXING AGENTS; CONSTANT COMPOSITION; DEPOSIT THICKNESS; ELECTROLYTIC BATHS; FACTORIAL DESIGN; FINE GRAINED; GLOSS; HIGH REFLECTIVITY; METAL SOURCES; NI-CU ALLOY; OPTICAL MIRROR; OPTIMIZATION PROCESS; PLATING BATH; POTENTIOSTATIC TECHNIQUES; SOLUTION PH; SULFAMATES;

COPPER ALLOYS; DEPOSITS; ELECTRODEPOSITION; ELECTROFORMING; ELECTROPLATING; MECHANICAL PROPERTIES; METALLIC FILMS; NICKEL; NICKEL COMPOUNDS; OPTICAL PROPERTIES; ORGANOMETALLICS; REFLECTION;

COPPER;

EID: 84856211491     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2011.12.049     Document Type: Article

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