Three-dimensional inkjet-printed interconnects using functional metallic nanoparticle inks

Advanced Functional Materials

Volumn 24, Issue 43, 2014, Pages 6834-6842

  Sadie, Jacob A ^a   Subramanian, Vivek ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; GOLD; METAL NANOPARTICLES; NANOPARTICLES; SINTERING;

APPLICATION SPECIFIC; COMPOSITIONAL PROPERTIES; ELECTRONIC PACKAGING; FLIP CHIP INTERCONNECTS; MECHANICAL PERFORMANCE; METALLIC NANOPARTICLES; PRINTED INTERCONNECTS; THREE-DIMENSIONAL NANOPARTICLES;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84922171457     PISSN: 1616301X     EISSN: 16163028     Source Type: Journal    
DOI: 10.1002/adfm.201401312     Document Type: Article

References (32)

1. D. Redinger, S. Molesa, S. Yin, R. Farshi, V. Subramanian, IEEE Tran. Electron Devices 2004, 51, 1978.
2. J. Perelaer, A. W. M. de Laat, C. E. Hendriks, U. S. Schubert, J. Mater. Chem. 2008, 18, 3209.
3. V. Subramanian, T. Bakhishev, D. Redinger, S. K. Volkman, J. Disp. Technol. 2009, 5, 525.
4. L. Jaggannathan, V. Subramanian, Biosens. Bioelectron. 2009, 25, 288.
5. V. Correia, C. Caparros, C. Casella, L. Francesch, J. G. Rocha, S. Lanceros-Mendez, Smart Mater. Struct. 2013, 22, 105028.
6. Y. Galagan, B. Zimmermann, E. W. C. Coenen, M. Jorgensen, D. M. Tanenbaum, F. C. Krebs, H. Gorter, S. Sabik, L. H. Slooff, S. C. Veenstra, J. M. Kroon, R. Andriessen, Adv. Energy Mater. 2012, 2, 103.
7. Y. Guillou, A-M. Dutron, Proc. IEEE Europ. Microelectron. Packag. Conf. 2009, 1.
8. D. Huang, F. Liao, S. Molesa, D. Redinger, V. Subramanian, J. Electrochem. Soc. 2003, 150, G412.
9. C. F. Luk, Y. Chan, K. Hung, Microelectron. Reliab. 2002, 42, 381.
10. J. Jordan, Proc. IEEE/CPMT/SEMI Int. Electron. Manuf. Technol. Symp., 27th 2002, 110.
11. A. Yeoh, M. Chang, C. Pelto, T-L. Huang, S. Balakrishnan, G. Leatherman, Proc. Electron. Compon. Technol. Conf. 2006, 1611.
12. M. Huang, O. G. Yeow, C. Y. Poo, T. Jiang, IEEE Trans. Comp., Packag. Technol. 2008, 31, 767.
13. S. Joblot, P. Bar, H. Sibuet, B. Reig, S. Jan, C. Arnaud, Y. Lamy, P. Coudrain, R. Coffy, O. Boillon, J. F. Carpenter, Microelectron. Eng. 2013, 107, 72.
14. F. Wang, L. Han, IEEE Tran. Compon., Packag., Manuf. Technol. 2013, 3, 930.
15. Y. Li, Y. Wu, B. Ong, J. Am. Chem. Soc. 2005, 127, 3266.
16. A. Kamyshny, J. Steinke, S. Magdassi, Open Appl. Phys. J. 2011, 4, 19.
17. S. K. Volkman, S. Yin, T. Bakhishev, K. Puntambekar, V. Subramanian, M. F. Toney, Chem. Mater. 2011, 23, 4634.
18. P. Buffat, J-P. Borel, Phys. Rev. A. 1976, 13, 2287.
19. J. S. Kang, J. Ryu, H. S. Kim, H. T. Hahn, J. Electron. Mater. 2011, 40, 2268.
20. J. Perelaer, B-J. de Gans, U. S. Schubert, Adv. Mater. 2006, 18, 2101.
21. M. Hummelgard, R. Zhang, H.-E. Nilsson, H. Olin, PLoS One 2011, 6, e17209.
22. T. Bakhishev, V. Subramanian, J. Electron. Mater. 2009, 38, 2720.
23. ITRS, International Technology Roadmap for Semiconductors-Assembly and Packaging, http://itrs.net/ (accessed: February, 2014).
24. J. Sadie, S. K. Volkman, V. Subramanian, Proc. Int. Symp. Microelectron., 46th 2012, 419.
25. K. Murata, IEEE. Int. Conf. Poly. Adhes. Microelectron. Photonics, 6th 2007, 293.
26. J. A. Lewis, Adv. Func. Mater. 2006, 16, 2193.
27. D. B. Wallace, D. J. Hayes, Int. J. Microcircuits Electro. Packag. 1998, 21.
28. J. R. Greer, R. A. Street, Acta Mater. 2007, 55, 6345.
29. National Institute of Standards and Technology, Database for Solder Properties with Emphasis on New Lead-Free Solders, http://www.msed.nist.gov/solder/ (accessed: June, 2014).
30. JEDEC, JESD22-B117A Solder Ball Shear, http://www.jedec.org/ (accessed: February, 2014).
31. AdvanPack Solutions Pte. Ltd., Products and Services, http://www.advanpack.com/ (accessed: February, 2014).
32. R. Anderson, S. J. Klepeis, in Introduction to Focused Ion Beams (Eds: L. A. Giannuzzi, F. A. Stevie), Springer, Boston, MA, USA 2005, Ch. 9.