Plasma-enhanced atomic layer deposition (PEALD) of cobalt thin films for copper direct electroplating

Surface and Coatings Technology

Volumn 259, Issue PA, 2014, Pages 98-101

  Park, Jae Hyung ^a   Moon, Dae Yong ^a   Han, Dong Suk ^a   Kang, Yu Jin ^a   Shin, So Ra ^a   Jeon, Hyung Tag ^a   Park, Jong Wan ^a  

^a Hanyang University   (South Korea)

Author keywords

Atomic layer deposition; CCTBA; Cobalt; Copper interconnect; Direct plating

Indexed keywords

ATOMIC LAYER DEPOSITION; ATOMS; COBALT; COPPER; INTEGRATED CIRCUIT INTERCONNECTS; METALLIC FILMS; PLATING; SILICA; TANTALUM COMPOUNDS; THIN FILMS;

CCTBA; COBALT THIN FILMS; COPPER INTERCONNECTS; DICOBALT HEXACARBONYL; DIRECT ELECTROPLATING; DIRECT PLATING; NANO-METER SCALE; PLASMA-ENHANCED ATOMIC LAYER DEPOSITION;

NITROGEN COMPOUNDS;

EID: 84920044969     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2014.05.005     Document Type: Article

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