Analysis of delay and dynamic crosstalk in bundled carbon nanotube interconnects

IEEE Transactions on Electromagnetic Compatibility

Volumn 56, Issue 6, 2014, Pages 1666-1673

  Majumder, Manoj Kumar ^a   Kaushik, B K ^a   Manhas, Sanjeev Kumar ^a  

^a INDIAN INSTITUTE OF TECHNOLOGY ROORKEE   (India)

Author keywords

Carbon nanotube (CNT); crosstalk; equivalent single conductor (ESC); in phase and out phase delay; mixed CNT bundle (MCB); propagation delay; VLSI interconnects

Indexed keywords

EID: 84919904762     PISSN: 00189375     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEMC.2014.2318017     Document Type: Article

References (33)

1. H. Li, C. Xu, N. Srivastava, and K. Banerjee, "Carbon nanomaterials for next-generation interconnects and passives: Physics, status and prospects, " IEEE Trans. Electron. Devices, vol. 56, no. 9, pp. 1799-1821, Sep. 2009.
2. M. K. Majumder, N. D. Pandya, B. K. Kaushik, and S. K. Manhas, "Analysis of MWCNT and bundled SWCNT interconnects: Impact on crosstalk and area, " IEEE Electron. Devices Lett., vol. 33, no. 8, pp. 1180-1182, Aug. 2012.
3. P. K. Das, M. K. Majumder, B. K. Kaushik, and S. Dasgupta, "Analysis of propagation delay in mixed carbon nanotube bundle as global VLSI interconnects, " in Proc. IEEE Asia Pacific Conf. Postgraduate Res. Mi-croelectron. Electron., Hyderabad, India, Dec. 2012, pp. 118-121.
4. M. K. Majumder, B. K. Kaushik, S. K. Manhas, and J. Kumar, "Analysis of crosstalk delay and power dissipation in mixed CNT bundle interconnects, " in Proc. IEEE Int. Conf. Commun., Devices Intell. Syst., Kolkata, India, Dec. 2012, pp. 361-364.
5. M. K. Majumder, B. K. Kaushik, and S. K. Manhas, "Analysis of mixed CNT bundle interconnects: Impact on delay and power dissipation, " in Proc. IEEE 5th Int. Conf. Comput. Devices Commun., Kolkata, India, Dec. 2012, pp. 1-4.
6. A. Naeemi and J. D. Meindl, "Compact physical models for multiwall carbon nanotube interconnects, " IEEE Electron. Device Lett., vol. 27, no. 5, pp. 338-340, May 2006.
7. A. Nieuwoudt and Y. Massoud, "Evaluating the impact of resistance in carbon nanotube bundles for VLSI interconnect using diameter-dependent modeling techniques, " IEEE Trans. Electron. Devices, vol. 53, no. 10, pp. 2460-2466, Oct. 2006.
8. D. Rossi, J. M. Cazeaux, C. Metra, and F. Lombardi, "Modeling crosstalk effects in CNT bus architecture, " IEEE Trans. Nanotechnol., vol. 6, no. 2, pp. 133-145, Mar. 2007.
9. S.-N. Pu, W.-Y. Yin, J.-F. Mao, and Q. H. Liu, "Crosstalk prediction of single-and double-walled carbon-nanotube (SWCNT/DWCNT) bundle interconnects, " IEEE Trans. Electron Devices, vol. 56, no. 4, pp. 560-568, Apr. 2009.
10. K.-H. Koo, H. Cho, P. Kapur, and K. C. Saraswat, "Performance comparison between carbon nanotubes, optical and Cufor future high-performance on-chip interconnect applications, " IEEE Trans. Electron Devices, vol. 54, no. 12, pp. 3206-3215, Dec. 2007.
11. H. Li, W.-Y. Yin, J.-F. Mao, and K. Banerjee, "Performance analysis of multi-walled carbon nanotube based interconnects, " in Proc. IEEE Int. Semicond. Device Res. Symp., College park, MD, USA, Dec. 2007, pp. 1-2.
12. L. Zhu, J. Xu, Y. Xiu, Y. Sun, D. W. Hess, and C. P. Wong, "Growth and electrical characterization of high-aspect-ratio carbon nanotube arrays, " Carbon, vol. 44, no. 2, pp. 253-258, Feb. 2006.
13. C. L. Cheung, A. Kurtz, H. Park, and C. M. Lieber, "Diameter-controlled synthesis of carbon nanotubes, " J. Phys. Chem., B, vol. 106, no. 10, pp. 2429-2433, Feb. 2002.
14. S. Haruehanroengra and W. Wang, "Analyzing conductance of mixed carbon nanotube bundles for interconnect applications, " IEEE Electron. Device Lett., vol. 28, no. 8, pp. 756-759, Aug. 2007.
15. S. D. Pable and M. Hasan, "Interconnect design for subthreshold circuits, " IEEE Trans. Nanotechnol., vol. 11, no. 3, pp. 633-639, May 2012.
16. S. Subash, J. Kolar, and M. H. Chowdhury, "A new spatially rearranged bundle of mixed carbon nanotube as VLSI interconnection, " IEEE Trans. Nanotechnol., vol. 12, no. 1, pp. 3-12, Jan. 2013.
17. M. K. Majumder, N. D. Pandya, B. K. Kaushik, and S. K. Manhas, "Dynamic crosstalk effect in mixed CNT bundle interconnects, " Electron. Lett., vol. 48, no. 7, pp. 384-385, Mar. 29, 2012.
18. P. U. Sathyakam and P. S. Mallick, "Transient analysis of mixed carbon nanotube bundle interconnects, " IET Electron. Lett., vol. 47, no. 20, pp. 1134-1136, Sep. 2011.
19. P. Uma Sathyakam, A. Karthikeyan, and P. S. Mallick, "Role of semiconducting carbon nanotubes in crosstalk reduction of CNT interconnects, " IEEE Trans. Nanotechnol., vol. 12, no. 5, pp. 662-664, Sep. 2013.
20. J. M. Rabaey, Digital Integrated Circuits, A Design Perspective. Engle-wood Cliffs, NJ, USA: Prentice-Hall, 1996.
21. B. K. Kaushik and S. Sarkar, "Crosstalk analysis for a CMOS-gate-driven coupled interconnects, " IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., vol. 27, no. 6, pp. 1150-1154, Jun. 2008.
22. W. C. Chen, W. Y. Yin, L. Jia, and Q. H. Liu, "Electrothermal characterization of single-walled carbon nanotube (SWCNT) interconnect arrays, " IEEE Trans. Nanotechnol., vol. 8, no. 6, pp. 718-728, Nov. 2009.
23. N. D. Pandya, M. K. Majumder, B. K. Kaushik, and S. K. Manhas, "Performance comparison of mixed CNT bundle in global VLSI interconnects, " in Proc. IEEE Int. Conf. Commun. Syst. Netw. Technol., Rajkot, India, May 2012, pp. 790-793.
24. M. S. Sarto and A. Tamburrano, "Electromagnetic analysis of radiofre-quency signal propagation along SWCNT bundles, " presented at the IEEE Conf. Nanotechnol., Cincinnati, OH, USA, Jul. 2006.
25. M. S. Sarto and A. Tamburrano, "Single-conductor transmission-line model of multiwall carbon nanotubes, " IEEE Trans. Nanotechnol., vol. 9, no. 1, pp. 82-92, Jan. 2010.
26. M. D'Amore, M. S. Sarto, and A. Tamburrano, "Fast transient analysis of next-generation interconnects based on carbon nanotubes, " IEEE Trans. Electromagn. Compat., vol. 52, no. 2, pp. 496-503, May 2010.
27. A. Naeemi and J. D. Meindl, "Performance modeling for single-and multiwall carbon nanotubes as signal and power interconnects in gigascale systems, " IEEE Trans. Electron. Devices, vol. 55, no. 10, pp. 2574-2582, Oct. 2008.
28. H. Li, W. Y. Yin, K. Banerjee, and J. F. Mao, "Circuit modeling and performance analysis of multi-walled carbon nanotube interconnects, " IEEE Trans. Electron. Devices, vol. 55, no. 6, pp. 1328-1337, Jun. 2008.
29. A. Naeemi and J. D. Meindl, "Physical modeling of temperature coefficient of resistance for single and multi-wall carbon nanotube interconnects, " IEEE Electron. Device Lett, vol. 28, no. 2, pp. 135-138, Feb. 2007.
30. M. D'Amore, A. G. D'Aloia, and M. S. Sarto, "High-frequency effective impedance of micro-wires based on carbon nanotube technology, " presented at the IEEE 9th Int. Symp. Electromagn. Compat., Wroclaw, Poland, Sep. 2010, pp. 14-17.
31. G. Antonini, A. Orlandi, and M. D'Amore, "Skin and proximity effects modeling in micro-wires based on carbon nanotube bundles, " presented at the IEEE 10th Int. Symp. Electromagn. Compat., York, U.K., Sep. 2011, pp. 26-30.
32. M. S. Sarto and A. Tamburrano, "Comparative analysis of TL models for multilayer graphene nanoribbon and multiwall carbon nanotube interconnects, " in Proc. IEEE Int. Symp. Electromagn. Compat., Fort Lauderdale, FL, USA, Jul. 2010, pp. 212-217.
33. S. Sanvito, Y.-K. Kwon, D. Tománek, and C. J. Lambert, "Fractional quantum conductance in carbon nanotubes, " Phys. Rev. Lett., vol. 84, no. 9, pp. 1974-1977, Feb. 2000.