Inkjet filling of TSVs with silver nanoparticle ink

ESTC 2014 - 5th Electronics System-Integration Technology Conference

Volumn , Issue , 2014, Pages

  Khorramdel, Behnam ^a   Mäntysalo, Matti ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL VAPOR DEPOSITION; CHIP SCALE PACKAGES; INK; INK JET PRINTERS; METAL NANOPARTICLES; MICROELECTRONICS; PRINTING PRESSES; SILICON WAFERS; SILVER NANOPARTICLES; SUBSTRATES;

CHEMICAL VAPOR DEPOSITIONS (CVD); DIGITAL FABRICATION; ELECTRICAL INTERCONNECTIONS; METALLIZATION PROCESS; MICRO-ELECTRONIC DEVICES; OUTER DIAMETERS; SUBSTRATE TEMPERATURE; THROUGH SILICON VIAS;

THREE DIMENSIONAL INTEGRATED CIRCUITS;

EID: 84918522612     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2014.6962741     Document Type: Conference Paper

References (14)

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