Through Silicon Vias and thermocompression bonding using inkjet-printed gold nanoparticles for heterogeneous MEMS integration

2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013

Volumn , Issue , 2013, Pages 834-837

  Quack, N ^a,b   Sadie, J ^b   Subramanian, V ^b   Wu, M C ^a,b  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

3D Integration; Chip Scale Packaging (CSP); Flip Chip Bonding; Inkjet Printing; Known Good Die (KGD); MEMS; Nanoparticle; Through Silicon Via (TSV)

Indexed keywords

3-D INTEGRATION; CHIP-SCALE PACKAGING; FLIP-CHIP BONDING; KNOWN-GOOD-DIE (KGD); THROUGH-SILICON-VIA (TSV);

ACTUATORS; GOLD; INTEGRATED CIRCUIT MANUFACTURE; MEMS; METAL NANOPARTICLES; MICROSYSTEMS; NANOPARTICLES; PRINTING; SOLID-STATE SENSORS;

INTEGRATION;

EID: 84891696133     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/Transducers.2013.6626896     Document Type: Conference Paper

References (12)

1. N. Quack, J. Ferrara, S. Gambini, S. Han, C. Keraly, P. Qiao, Y. Rao, P. Sandborn, L. Zhu, S.-L. Chuang, E. Yablonovitch, B. Boser, C. Chang-Hasnain, M. C. Wu, "Development of an FMCW LADAR Source Chip using MEMS-Electronic- Photonic Heterogeneous Integration", GOMACTech Conference, 13-4, Las Vegas, NV, USA, March 12-14, 2013.
2. M. Motoyoshi, "Through-Silicon Via (TSV)", Proc. of IEEE, Special Issue on 3-D Integration Technologies, Vol. 97, No. 1, 2009, pp. 43-48.
3. B.W. Yoo, M. Megens, T. Chan, T. Sun, W. Yang, C.J. Chang-Hasnain, D.A. Horsley, and M.C. Wu, "Optical phased array using high contrast gratings for 2D beamforming and beamsteering," Optics Express, April 2013 (accepted, in press).
4. U. Kang, H.-J. Chung, S. Heo, D.-H. Park, H. Lee, J.-H. Kim, S.-H. Ahn, S.-H. Cha, J. Ahn, D.-M. Kwon, J.-W. Lee, H.-S. Joo, W.-S. Kim, D.-H. Jang, N.-S. Kim, J.-H. Choi, T.-G. Chung, J.-H. Yoo, J. S. Choi, C. Kim, Y.-H. Jun, "8 Gb 3-D DDR3 DRAM Using Through-Silicon-Via Technology", IEEE Journal of Solid-State Circuits, Vol. 45, No. 1, 2010, pp. 111-119.
5. J. Burns, B. Aull, C. Chen, C.-L. Chen, C. Keast, J. Knecht, V. Suntharalingam, K. Warner, P. Wyatt, D.-R. Yost, "A Wafer-Scale 3-D Circuit Integration Technology", IEEE Transactions on Electron Devices, Vol. 53, No. 10, 2006, pp. 2507-2516
6. M. Rimskog, T. Bauer, "High density through silicon via (TSV)", 2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Nice, France, 9-11 April 2008.
7. Y. Temiz, M. Zervas, C. Guiducci, and Y. Leblebici, "Die-Level TSV Fabrication Platform for CMOSMEMS Integration", in Digest Tech. Papers Transducers'11 Conference, Beijing, China, June 5-9, 2011, pp. 1799-1802.
8. K. Bourzac, "Photonic chips made easier," Nature, vol. 483, no. 7390, p. 388, 2012.
9. T. Bakhishev and V. Subramanian, "Investigation of Gold Nanoparticle Inks for Low-Temperature Lead-Free Packaging Technology", J. Elec. Mat., Vol. 28, No. 12, pp. 2720-2725, 2009.
10. A. Rathjen, Y. Bergmann, K. Krüger, "Feasibility Study: Inkjet Filling of Through Silicon Vias (TSV)", in NIP28: International Conference on Digital Printing Technologies and Digital Fabrication 2011, Quebec, Canada, Sept. 2012, pp. 456-460.
11. P. Buffat and J.P. Borel, "Size Effect on the Melting Temperature of Gold Particles", Phys. Rev. A, Vol. 13, No. 6, pp. 2287-2298, 1975.
12. J. Sadie, S. Volkman, V. Subramanian, "Demonstration of Inkjet Printed Nanoparticle-based Inks for Solder Bump Replacement", in Proc. of 2012 45th International Symposium on Microelectronics, San Diego, CA, USA, Sept. 2012, pp. 419-424.