Oven sintering process optimization for inkjet-printed Ag Nanoparticle ink

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 3, Issue 2, 2013, Pages 350-356

  Halonen, Eerik ^a   Viiru, Tanja ^a   Östman, Kauko ^a   Cabezas, Ana Lopez ^b   Mantysalo, Matti ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

^b ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

Adhesion; inkjet; printable electronics; sintering

Indexed keywords

AG NANOPARTICLE; CONDUCTOR RESISTIVITY; INKJET; POLYIMIDE SUBSTRATE; POLYMER SUBSTRATE; PRINTABLE ELECTRONICS; RESISTANCE MEASUREMENT; SILVER NANOPARTICLES; SINTERING CONDITION; SINTERING TEMPERATURES; SINTERING TIME; SUBSTRATE MATERIAL; THREE TEMPERATURE; TIME POINTS;

ADHESION; INK; NANOPARTICLES; OPTIMIZATION; OVENS; POLYIMIDES; SILVER; SUBSTRATES;

SINTERING;

EID: 84873472361     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2012.2226458     Document Type: Article

References (34)

1. S. E. Molesa, "Ultralow-cost printed electronics," Dept. Electr. Eng. Comput. Sci., Univ. California at Berkeley, Berkeley, Tech. Rep. UCB/EECS-2006-55. p. 183.
2. M. A. M. Leenen, V. Arning, H. Thiem, J. Steiger, and R. Anselmann, "Printable electronics: Flexibility for the future," Phys. Status Solidi A, Appl. Mater., vol. 206, no. 4, pp. 588-597, 2009.
3. H. Kang, D. Soltman, and V. Subramanian, "Hydrostatic optimization of inkjet-printed films," Langmuir, vol. 26, no. 13, pp. 11568-11573, 2010.
4. V. Pekkanen, K. Kaija, M. Mäntysalo, E. Kunnari, J. Niittynen, and P. Mansikkamäki, "Functional fluid jetting performance optimization," Microelectron. Rel., vol. 50, no. 6, pp. 864-871, Jun. 2010.
5. D. J. Lee and J. H. Oh, "Inkjet printing of conductive Ag lines and their electrical and mechanical characterization," Thin Solid Films, vol. 518, no. 22, pp. 6352-6356, Sep. 2010.
6. R. A. Street and W. S. Wong, "Jet printing flexible displays," Mater. Today, vol. 9, no. 4, pp. 32-37, 2006.
7. A. Scandurra, G. F. Indelli, N. G. Spartà, F. Galliano, S. Ravesi, and S. Pignataro, "Low-temperature sintered conductive silver patterns obtained by inkjet printing for plastic electronics," Surf. Interf. Anal., vol. 42, nos. 6-7, pp. 1163-1167, 2010.
8. D. J. Lee and J. H. Oh, "Inkjet printing of conductive Ag lines and their electrical and mechanical characterization," Thin Solid Films, vol. 518, no. 22, pp. 6352-6356, 2010.
9. R. D. Mancosu, J. A. Q. Quintero, and R. E. S. Azevedo, "Sintering, in different temperatures, of traces of silver printed in flexible surfaces," in Proc. 11th Int. Conf. Thermal, Mech. Multiphys. Simul., Experim. Microelectron. Microsyst., 2010, no. 5464510, pp. 1-5.
10. H. Saito and Y. Matsuba, "Liquid wiring technology by ink-jet printing using NanoPaste," in Proc. 39th Int. Symp. Microelectron., San Diego, CA, pp. 470-477, 2006.
11. J. Pekkanen, M. Heino, P. Mansikkamäki, M. Mäntysalo, and R. Rönkkä, "Laser sintering of AG nano paste for printed electronics," in Proc. Nanotech Nothern Eur., Helsinki, Finland, Mar. 2007, pp. 78-79.
12. T. Kumpulainen, J. Pekkanen, J. Valkama, J. Laakso, R. Tuokko, and M. Mäntysalo, "Low temperature nanoparticle sintering with continuous wave and pulse lasers," Opt. Laser Technol., vol. 43, no. 3, pp. 570-576, 2011.
13. M.-K. Kim, H. Kang, K. Kang, S.-H. Lee, J. Y. Hwang, and S.-J. Moon, "Laser sintering of inkjet-printed silver lines on glass and PET substrates," Trans. Korean Soc. Mech. Eng., vol. 34, no. 11, pp. 975-982, 2010.
14. H.-S. Kim, S. R. Dhage, S.-E. Shim, and H. T. Hahn, "Intense pulsed light sintering of copper nanoink for printed electronics," Appl. Phys. A, Mater. Sci. Process., vol. 97, no. 4, pp. 791-798, 2009.
15. J. Perelaer, M. Klokkenburg, C. E. Hendriks, and U. S. Schubert, "Microwave flash sintering of inkjet-printed silver tracks on polymer substrates," Adv. Mater., vol. 21, no. 47, pp. 4830-4834, 2009.
16. A. Denneulin, A. Blayo, C. Neuman, and J. Bras, "Infra-red assisted sintering of inkjet printed silver tracks on paper substrates," J. Nanoparticle Res., vol. 13, no. 9, pp. 3815-3823, 2011.
17. M. L. Allen, M. Aronniemi, T. Mattila, A. Alastalo, K. Ojanperä, M. Suhonen, and H. Seppä, "Electrical sintering of nanoparticle structures," Nanotechnology, vol. 19, no. 17, pp. 175201-1-175201-4, 2008.
18. M. Hummelgård, R. Zhang, H.-E. Nilsson, and H. Olin, "Electrical sintering of silver nanoparticle ink studied by in-situ TEM probing," PLoS ONE, vol. 6, no. 2, p. e17209, 2011.
19. H. C. Jung, S.-H. Cho, J. W. Joung, and Y.-S. Oh, "Studies on inkjetprinted conducting lines for electronic devices," J. Electron. Mater., vol. 36, no. 9, pp. 1211-1218, 2007. (Pubitemid 47321724)
20. J. Greer and R. A. Street, "Thermal cure effects on electrical performance of nanoparticle silver inks," Acta Mater., vol. 55, no. 18, pp. 6345-6349, 2007. (Pubitemid 47539251)
21. S.-L. Yi, J.-K. Jung, S.-H. Choi, I. Kim, H. C. Jung, J. Joung, and Y.-C. Joo, "Effect of microstructure on electrical and mechanical properties: Impurities of inkjet-printed Ag and Cu interconnects," in Proc. Electron. Compon. Technol. Conf., 2008, pp. 1277-1281.
22. S. Joo and D. F. Baldwin, "Interfacial adhesion of nano-particle silver interconnects for electronics packaging application," in Proc. Electron. Compon. Technol. Conf., 2008, no. 4550163, pp. 1417-1423.
23. S.-C. Park and Y.-B. Park, "Effect of temperature/humidity treatment conditions on interfacial adhesion energy between inkjet-printed Ag and polyimide," Jpn. J. Appl. Phys., vol. 48, no. 8, pp. 08HL021-08HL026, 2009.
24. A. Sridhar, D. J. van Dijk, and R. Akkerman, "Inkjet printing and adhesion characterisation of conductive tracks on a commercial printed circuit board material," Thin Solid Films, vol. 517, no. 16, pp. 4633- 4637, 2009.
25. A. Goldshmidt and H. Streitberger, Basf Handbook on Basic Coating Technology. Münster, Germany: Vincentz Network, 2003, p. 792.
26. V. Pekkanen, M. Mäntysalo, J. Miettinen, and P. Mansikkamäki, "Novel packaging technology for Combo memory package," in Proc. 16th Eur. Microelectron. Packag. Conf. Exhibit., Oulu, Finland, Jun. 2007, pp. 1-6.
27. V. Pekkanen, M. Mäntysalo, and P. Mansikkamäki, "Design considerations for inkjet printed electronic interconnections and packaging," in Proc. 40th Int. Symp. Microelectron., Nov. 2007, pp. 1-8.
28. M. Mäntysalo and P. Mansikkamäki, "Inkjet deposited interconnections for electronic packaging," in Proc. IST Digit. Fabricat., Sep. 2007, pp. 813-817. (Pubitemid 350301965)
29. K. Murata, "Super-fine ink-jet printing for nanotechnology," in Proc. Int. Conf. MEMS, NANO Smart Syst., Banff, AB, Canada, Jul. 2003, pp. 346-349.
30. K. Murata, J. Matsumoto, A. Tezuka, Y. Matsuba, and H. Yokohama, "Super-fine inl-jet printing: Toward the minimal manufacturing system," Microsyst. Technol., vol. 12, nos. 1-2, pp. 2-7, 2005. (Pubitemid 43060911)
31. S. Koskinen, L. Pykäri, and M. Mäntysalo, "Inkjet printed flexible user interface module," in Proc. 62nd Electron. Compon. Technol. Conf., San Diego, CA, May-Jun. 2012, pp. 1009-1014.
32. Harima Chemicals, Inc. (2009). Nanopaste Series Datasheet [Online]. Available: http://www.harima.co.jp/en/products/pdf/16-17e.pdf
33. S. K. Volkman, S. Yin, T. Bakhishev, K. Puntambekar, V. Subramanian, and M. F. Toney, "Mechanistic studies on sintering of silver nanoparticles," Chem. Mater., vol. 23, no. 20, pp. 4634-4640, 2011.
34. M. Mäntysalo, L. Xie, F. Jonsson, Y. Feng, A. L. Cabezas, and L.-R. Zheng, "System integration of smart packages using printed electronics," in Proc. Electron. Compon. Technol. Conf., San Diego, CA, May-Jun. 2012, pp. 997-1002.