Feasibility study: Inkjet filling of Through Silicon Vias (TSV)

International Conference on Digital Printing Technologies

Volumn , Issue , 2012, Pages 456-460

  Rathjen, Andreas ^a   Bergmann, Yvonne ^b   Krug̈er, Klaus ^a  

^a HELMUT SCHMIDT UNIVERSITY   (Germany)

^b ROBERT BOSCH GMBH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL ISOLATION; FEASIBILITY STUDIES; MICRO-ELECTRONIC DEVICES; MULTIPLE STRUCTURES; PIEZOELECTRIC INK JETS; PROCESSING TECHNIQUE; SCANNING ELECTRON MICROSCOPE; THROUGH SILICON VIAS;

INDUSTRIAL APPLICATIONS; INK; INK JET PRINTING; MICROELECTRONICS; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SINTERING;

SILVER;

EID: 84875707121     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. Kenji Takahashi et al., Development of Advanced 3D Chip Stacking Technology with Ultra-Fine Interconnection, Electronic Components and Technology Conference, pg. 541-546. (2001).
2. Navas Khan et al., Development of 3D Silicon Module with TSV for System in Packaging, Electronic Components and Technology Conference, pg. 550-555. (2008).
3. Steve Lien-Chung Hsu, Rong-Tarng Wu, Preparation of Silver Nanoparticle with Different Particle Sizes for Low-Temperature Sintering, 2010 International Conference on Nanotechnology and Biosensors, pg. 55-58. (2010).
4. M. Wassmer, W. Diel, K. Krueger, "Inkjet Printing of Fine-Line Thick-Film Inductors," Journal of Micro. & Elect. Pkg., 7, 4 (2010).
5. S. M. Bidoki, J. Nouri, A. A. Heidari, "Inkjet Deposited Circuit Components," J. Micromech. Microeng., 20, 5 (2010).
6. th International Conference on Digital Printing Technologies, pg. 702-706. (2008).