Progress towards filling through silicon vias with conductive ink

Proceedings of the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012

Volumn , Issue , 2012, Pages 691-694

  Cummins, Gerard ^a,b   Ng, Jack H G ^a   Kay, Robert ^c   Terry, Jonathan G ^a   Desmulliez, Marc P Y ^a   Walton, Anthony J ^c  

^a HERIOT WATT UNIVERSITY   (United Kingdom)

^b UNIVERSITY OF EDINBURGH   (United Kingdom)

^c LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITIVE MANUFACTURING TECHNOLOGY; CONDUCTIVE INK; DIRECT WRITE; ELECTRONIC PACKAGING; ENABLING TECHNOLOGIES; FLEXIBLE PACKAGINGS; PRINTING TECHNOLOGIES; THROUGH SILICON VIAS;

ELECTRONICS PACKAGING; INK JET PRINTING; MANUFACTURE;

TECHNOLOGY;

EID: 84879753648     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2012.6507170     Document Type: Conference Paper

References (12)

1. M. Singh, H. M. Haverinen, P. Dhagat, and G. E. Jabbour, "Inkjet printing-process and its applications.," Advanced Materials, vol. 22, no. 6, pp. 673-85, Feb. 2010.
2. M. Mäntysalo and P. Mansikkamäki, "Inkjetdeposited interconnections for electronic packaging," in International conference on digital printing technologies, 2007, vol. 23, pp. 813-817.
3. M. Mäntysalo et al., "Evaluation of Inkjet Technology for Electronic Packaging and System Integration," in 2007 Proceedings 57th Electronic Components and Technology Conference, 2007, pp. 89-94.
4. T. Bakhishev and V. Subramanian, "Investigation of Gold Nanoparticle Inks for Low-Temperature Lead-Free Packaging Technology," Journal of Electronic Materials, vol. 38, no. 12, pp. 2720-2725, Dec. 2009.
5. S. F. Al-Sarawi, D. Abbott, and P. D. Franzon, "A review of 3-D packaging technology," Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on, vol. 21, no. 1, pp. 2-14, Feb. 1998.
6. G. S. Hwang and K. P. Giapis, "On the origin of the notching effect during etching in uniform high density plasmas," Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures, vol. 15, no. 1, pp. 70-87, Jan. 1997.
7. P. Buffat and J. P. Borel, "Size effect on the melting temperature of gold particles," Physical Review A, vol. 13, no. 6, pp. 2287-2298, 1976.
8. B. Derby, "Inkjet Printing of Functional and Structural Materials: Fluid Property Requirements, Feature Stability, and Resolution," Annual Review of Materials Research, vol. 40, no. 1, pp. 395-414, 2010.
9. K.-S. Kwon, "Experimental analysis of waveform effects on satellite and ligament behavior via in situ measurement of the drop-on-demand drop formation curve and the instantaneous jetting speed curve," Journal of Micromechanics and Microengineering, vol. 20, no. 11, Nov. 2010.
10. D. Soltman and V. Subramanian, "Inkjet-Printed Line Morphologies and Temperature Control of the Coffee Ring Effect," Langmuir, vol. 24, no. 5, pp. 2224-2231, Jan. 2008.
11. A. L. Yarin, "Drop Impact Dynamics: Splashing, Receding, Bouncing," Annual Review of Fluid Mechanics, vol. 38, no. 1, pp. 159-192, Jan. 2006.
12. R. D. Deegan, O. Bakajin, T. F. Dupont, G. Huber, S. R. Nagel, and T. A. Witten, "Capillary flow as the cause of ring stains from dried liquid drops," Nature, vol. 389, no. 6653, pp. 827-829, Oct. 1997.