Inkjet-deposited interconnections for electronic packaging

International Conference on Digital Printing Technologies

Volumn , Issue , 2007, Pages 813-817

  Mäntysalo, Matti ^a   Mansikkamäki, Pauliina ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

Author keywords

[No Author keywords available]

Indexed keywords

ENCAPSULATION; INK; PACKAGING; SINTERING;

DIELECTRIC INKS; ELECTRONIC MANUFACTURING; ELECTRONIC PACKAGING; INKJET TECHNOLOGY; SYSTEM-IN-PACKAGE (SIP);

PRINTING;

INK; PACKAGING; PRINTING; SINTERING;

EID: 37349093320     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

1. th ECTC, Reno, NV, USA, (2007)
2. th EMPC, Oulu, Finland, (2007)
3. th International Symposium on Microelectronics, San Diego, USA, pp. 484-490, (2006)
4. th EMPC, Oulu, Finland, (2007)
5. Buffat Ph., Borel J-P., Size Effect on The Melting Temperature of Gold Particles, Physical Review A, Vol. 13, No. 6, (1976)
6. th International Symposium on Microelectronics, San Diego, USA, (2006).
7. Pekkanen J., Heino M., Mansikkamäki P., Mäntysalo M., Rönkkä R., Laser Sintering of Ag Nano Paste for Printed eElectronics, Nanotech Northern Europe 2007, Helsinki, Finland, (2007).
8. Brieri N., Chung J., Haferl S., Poulikakos D., Grigoropoulos C., Microstructuring by printing and laser curing of nanoparticle solutions, Applied Physics Letters, vol. 82, number 20, pp. 3529-3541, (2003)
9. Jolke Perelaer, Berend-Jan de Gans, and Ulrich S. Schubert, Ink-jet Printing and Microwave Sintering of Conductive Silver Tracks, Advanced materials, No. 18, (2006)
10. de Gennes P.G., "Wetting: Statics and Dynamics", Reviews of Modem Physics, Vol. 57, No. 3, Part 1, (1985)
11. Murata, K., and Shimizu K., Micro bump formation by using a super fine inkjet system, in Proc 39th International Symposium on Microelectronics, San Diego, USA, (2006).