A Health-IoT platform based on the integration of intelligent packaging, unobtrusive bio-sensor, and intelligent medicine box

IEEE Transactions on Industrial Informatics

Volumn 10, Issue 4, 2014, Pages 2180-2191

  Yang, Geng ^a   Xie, Li ^a   Mäntysalo, Matti ^b   Zhou, Xiaolin ^c   Pang, Zhibo ^d   Xu, Li Da ^e,f,g,h   Kao Walter, Sharon ⁱ   Chen, Qiang ^a   Zheng, Li Rong ^a,c  

^a ROYAL INSTITUTE OF TECHNOLOGY   (Sweden)

^b TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

^c FUDAN UNIVERSITY   (China)

^d ABB CORPORATE RESEARCH   (Sweden)

^e INSTITUTE OF COMPUTING TECHNOLOGY   (China)

^f SHANGHAI JIAO TONG UNIVERSITY   (China)

^g UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA   (China)

^h OLD DOMINION UNIVERSITY   (United States)

ⁱ BLEKINGE INSTITUTE OF TECHNOLOGY   (Sweden)

Author keywords

Bio Patch; Health IoT; intelligent medicine box (iMedBox); intelligent packaging; Internet of Things (IoT); printed electronics

Indexed keywords

BIO-PATCH; INTELLIGENT MEDICINE BOX (IMEDBOX); INTELLIGENT PACKAGING; INTERNET-OF-THINGS; PRINTED ELECTRONICS;

EID: 84908636513     PISSN: 15513203     EISSN: None     Source Type: Journal    
DOI: 10.1109/TII.2014.2307795     Document Type: Article

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