Utilizing inkjet printing to fabricate electrical interconnections in a system-in-package

Microelectronic Engineering

Volumn 87, Issue 11, 2010, Pages 2382-2390

  Pekkanen, Ville ^a   Mäntysalo, Matti ^a   Kaija, Kimmo ^a   Mansikkamäki, Pauliina ^b   Kunnari, Esa ^a   Laine, Katja ^a   Niittynen, Juha ^a   Koskinen, Santtu ^a   Halonen, Eerik ^a   Caglar, Umur ^a  

^a TAMPERE UNIVERSITY OF TECHNOLOGY   (Finland)

^b NOKIA RESEARCH CENTER   (United States)

Author keywords

Inkjet; Printed electronics; Process optimization; System in package

Indexed keywords

AFFECTING FACTORS; DESIGNED EXPERIMENTS; ELECTRICAL INTERCONNECTIONS; ELECTRONIC PACKAGE; ERROR SOURCES; INKJET-PRINTED ELECTRONICS; MANUFACTURING STAGES; NANO-PARTICLE METAL; OPTIMIZED PROCESS; POLYMER DIELECTRICS; PRINTING PROCESS; PROCESS OPTIMIZATION; PROCESS PERFORMANCE; PROCESS YIELD; SIGNIFICANT FACTORS; SYSTEM IN PACKAGE;

INK; INK JET PRINTERS; INK JET PRINTING; PACKAGING; PRINTING PRESSES; PROCESS CONTROL;

OPTIMIZATION;

EID: 77955513367     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2010.04.013     Document Type: Article

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