Package embedded decoupling capacitor impact on core power delivery network for ARM SoC application

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2014, Pages 354-359

  Kim, Gawon ^a   Min, Max Sunghwan ^a   Yang, Melinda Ling ^a   Gundurao, Anil ^a   You, Eileen ^a   Gill, Harpreet ^a   Cha, Seungyong ^b   Kim, Younghoon ^b   You, Se Ho ^b   Lee, Seungbae ^b   Ryu, Woonghwan ^b  

^a Samsung Advanced Institute of Technology (SAIT)   (South Korea)

^b SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ARM PROCESSORS; ELECTRIC POWER TRANSMISSION; FREQUENCY DOMAIN ANALYSIS; PROGRAMMABLE LOGIC CONTROLLERS;

DYNAMIC VOLTAGE; EMBEDDED DECOUPLING; FREQUENCY DOMAINS; FREQUENCY RANGES; POWER DELIVERY NETWORK; POWER DISTRIBUTION NETWORK; SOC APPLICATION; TARGET IMPEDANCES;

SYSTEM-ON-CHIP;

EID: 84907885389     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2014.6897311     Document Type: Conference Paper

References (8)

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8. nd Electrical Performance of Electronic Packaging and Systems (EPEPS) 2013, pp. 215-218.