Embedded capacitors in the next generation processor

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2013, Pages 1225-1229

  Min, Yongki ^a   Olmedo, Reynaldo ^a   Hill, Michael ^a   Radhakrishnan, Kaladhar ^a   Aygun, Kemal ^a   Kabiri Badr, Mostafa ^a   Panat, Rahul ^a   Dattaguru, Sriram ^a   Balkan, Haluk ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL PERFORMANCE; ELECTRONIC PACKAGE; EMBEDDED CAPACITOR; EMBEDDED PASSIVES; HAND HELD DEVICE; HIGH PERFORMANCE COMPUTERS; POWER DELIVERY; SMALL FORM FACTORS;

APPROXIMATION THEORY; COMPUTER APPLICATIONS; ELECTRIC POWER TRANSMISSION; TECHNOLOGY;

CAPACITORS;

EID: 84883390754     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2013.6575731     Document Type: Conference Paper

References (4)

1. Clive Hendricks, Yongki Min, Tim Lane, "Reliability Challenges for CPU Decoupling MLCC," in Proc. Capacitor and Resistor Technology Symposium USA (CARTS), New Orleans, Louisiana, March 15-18, 2010, pp. 279-288
2. Murata Technical Report, Evolving capacitors Monolithic Ceramic Capacitors, Part 3 Product Trend(1), Trends in Size Reduction of Monolithic Ceramic Capacitors Spotlight on Ultrathin Models & Array Structure, http://www.murata.com/products/article/pp09e1/3.html
3. Kozo Yamasaki, "Low inductance embedded capacitance Technology", iNEMI Packaging Substrates Workshop, Nagoya, Japan, November 17-18, 2009
4. Aygun, K., Hill, M.J., Ellert, K.D., Radhakrishnan, K., "Measurement to Modeling correlation of the power delivery network impedance of a microprocessor system," in Proc. 13th Topical Meeting on the Electrical Performance of Electronic Packaging (EPEP), Portland, Oregon, October 25-27, 2004, pp. 221-224