Suppression of GHz Range Power/Ground Inductive Impedance and Simultaneous Switching Noise Using Embedded Film Capacitors in Multilayer Packages and PCBs

IEEE Microwave and Wireless Components Letters

Volumn 14, Issue 2, 2004, Pages 71-73

  Kim, Hyungsoo ^a   Sun, Byung Kook ^b   Kim, Joungho ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

^b Samsung Electro Mechanics   (South Korea)

Author keywords

Decoupling capacitor; Embedded film capacitor; Power integrity; Power ground impedance; Simultaneous switching noise

Indexed keywords

APPROXIMATION THEORY; ELECTRIC IMPEDANCE; HARMONIC ANALYSIS; MULTILAYERS; PERMITTIVITY; PH EFFECTS; PRINTED CIRCUIT BOARDS; RESONANCE; SCANNING ELECTRON MICROSCOPY; SWITCHING;

DECOUPLING CAPACITOR; EMBEDDED FILM CAPACITOR; POWER INTEGRITY; POWER/GROUND IMPEDANCE; SIMULTANEOUS SWITCHING NOISE;

CAPACITORS;

EID: 1642402127     PISSN: 15311309     EISSN: None     Source Type: Journal    
DOI: 10.1109/LMWC.2003.822568     Document Type: Article

References (3)

1. L. D. Smith, R. E. Anderson, D. W. Forehand, T. J. Pelc, and T. Roy, "Power distribution system design methodology and capacitor selection for modern CMOS technology," IEEE Trans. Adv. Packag., vol. 22, Aug. 1999.
2. M. Xu, T. H. Hubing, J. Chen, T. P. Van Doren, J. L. Drewnial, and R. E. DuBroff, "Power-bus decoupling with embedded capacitance in printed circuit board design," IEEE Trans. Electromag. Compat., vol. 45, pp. 22-30, Feb. 2003.
3. I. Novak, "Measuring milliohms and picohenrys in power-distribution networks," in 2000 High-Performance System Design Conf., Santa Clara, CA, 2000.