Warpage and electrical performance of embedded device package, MCeP

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 1377-1383

  Tanaka, Kouichi ^a   Kurashima, Nobuyuki ^a   Iizuka, Hajime ^a   Ooi, Kiyoshi ^a   MacHida, Yoshihiro ^a   Koyama, Tetsuya ^a  

^a SHINKO ELECTRIC INDUSTRIES CO LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DECOUPLING CAPACITOR; ELECTRICAL PERFORMANCE; ELECTRICAL SIMULATION; EMBEDDED DEVICE; EMBEDDED PASSIVES; LAYER THICKNESS; LAYER THICKNESS EFFECT; MOLDED CORE; PACKAGE SIZE; SIMULATION METHODS; WARPAGES;

CAPACITORS;

EID: 79960428424     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898691     Document Type: Conference Paper

References (3)

1. Y. Machida, "Development of Molded Core embedded Package (MCeP)." JIEP EPADs workshop, Tokyo Japan, July 2008, pp. 62-73
2. K. Tanaka, "Development of Active Device embedded Substrate." JIEP Kansai workshop 2008, Kyoto Japan, July 2008, pp. 14
3. Joong-Ho Kim et al, "Characterization of Discrete Decoupling Capacitors for High-Speed Digital Systems." in Proc. 54th Electronic Components and Technology Conference, Las Vegas, June. 2004, pp. 259-265