Directed self-assembly of nanoparticles for novel electrical interconnects

2012 4th Electronic System-Integration Technology Conference, ESTC 2012

Volumn , Issue , 2012, Pages

  Liu, Yu ^a   Schlottig, Gerd ^a   Wolf, Heiko ^a   Sotiriou, Georgios A ^b   Brunschwiler, Thomas ^a  

^a IBM RESEARCH ZURICH   (Switzerland)

^b ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CHIP SCALE PACKAGES; ELECTRIC CONDUCTIVITY; ELECTRIC RESISTANCE; ELECTRONICS ENGINEERING; EVAPORATION; NANOPARTICLES; PROBES; SELF ASSEMBLY; SILVER; X RAY DIFFRACTION ANALYSIS;

ANNEALING TEMPERATURES; DIRECTED SELF-ASSEMBLY; ELECTRICAL CONDUCTIVITY; ELECTRICAL INTERCONNECTS; ELECTRICAL RESISTANCES; HIGH ELECTRICAL CONDUCTIVITY; IN-SITU CHARACTERIZATION; KELVIN PROBE MEASUREMENTS;

INTEGRATED CIRCUIT INTERCONNECTS;

EID: 84902479847     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2012.6542081     Document Type: Conference Paper

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