Effect of formic acid vapor in situ treatment process on Cu low-temperature bonding

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 4, Issue 6, 2014, Pages 951-956

  Yang, Wenhua ^a,b   Akaike, Masatake ^a   Suga, Tadatomo ^a  

^a UNIVERSITY OF TOKYO   (Japan)

^b HEFEI UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Cu Cu direct bonding; formic acid vapor; low temperature

Indexed keywords

ATMOSPHERIC TEMPERATURE; BONDING; CHEMICAL BONDS; COPPER; FORMIC ACID; GRAIN BOUNDARIES; SURFACE ROUGHNESS;

DIRECT BONDING; IN-SITU TREATMENT; INITIAL TREATMENT; LOW TEMPERATURE BONDING; LOW TEMPERATURES; SURFACE REDUCTION; TREATMENT CONDITIONS; TREATMENT TEMPERATURE;

VAPORS;

EID: 84902075585     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2014.2315761     Document Type: Article

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