Low temperature Cu-Cu direct bonding using formic acid vapor pretreatment

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 2079-2083

  Yang, Wenhua ^a   Shintani, Hiroyuki ^a   Akaike, Masatake ^a   Suga, Tadatomo ^a  

^a UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AFTER-TREATMENT; BONDING INTERFACES; BONDING STRENGTH; CU FILMS; DIRECT BONDING; DRY PROCESS; IN-SITU; LOW TEMPERATURES; LOW VACUUM; PRE-TREATMENT; TREATMENT CONDITIONS;

FORMIC ACID; METALLIC FILMS; PHOTOELECTRON SPECTROSCOPY; TRANSMISSION ELECTRON MICROSCOPY; VAPORS; X RAY PHOTOELECTRON SPECTROSCOPY;

COPPER;

EID: 79960415289     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898804     Document Type: Conference Paper

References (11)

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