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Volumn 3, Issue 2, 2013, Pages 229-241

A thermal model for carbon nanotube interconnects

Author keywords

Joule heating; Scattering; SWCNT; VLSI interconnect

Indexed keywords


EID: 84902072723     PISSN: None     EISSN: 20794991     Source Type: Journal    
DOI: 10.3390/nano3020229     Document Type: Article
Times cited : (26)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.