Electro-thermal transport in metallic single-wall carbon nanotubes for interconnect applications

Technical Digest - International Electron Devices Meeting, IEDM

Volumn 2005, Issue , 2005, Pages 253-256

  Pop, Eric ^a,b   Mann, David ^a   Reifenberg, John ^b   Goodson, Kenneth ^b   Dai, Hongjie ^a  

^a STANFORD UNIVERSITY   (United States)

^b Stanford University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; ELECTRIC BREAKDOWN; OPTICAL INTERCONNECTS; PHONONS; TRANSPORT PROPERTIES;

ELECTROTHERMAL TRANSPORT; HIGH BIAS; INTERCONNECT APPLICATIONS; POWER DENSITIES;

SINGLE-WALLED CARBON NANOTUBES (SWCN);

EID: 33847738969     PISSN: 01631918     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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