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Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics

Volumn 27, Issue 3, 2009, Pages 1086-1092

Carbon nanotube array vias for interconnect applications

(3) Ting, Jyh Hua a Chiu, Ching Chieh b Huang, Fuang Yuan b

a NATIONAL NANO DEVICE LABORATORIES (Taiwan)

b NATIONAL CENTRAL UNIVERSITY (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON NANOTUBES; CATALYSTS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; TANTALUM;

CARBON NANOTUBE ARRAY; CONDUCTING CHANNELS; ELECTRICAL RESISTANCES; ETCHING EFFECT; GLOBAL INTERCONNECTS; GROWTH PARAMETERS; INTERCONNECT APPLICATIONS; METAL ELECTRODES; MICROWAVE PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION; NICKEL CATALYST; PACKING DENSITY; PRE-TREATMENT; SUBSTRATE TEMPERATURE; TRANSVERSE MOTIONS; VIA CHAIN; VIA RESISTANCE;

PLASMA DEPOSITION;

EID: 78650094325 PISSN: 21662746 EISSN: 21662754 Source Type: Journal
DOI: 10.1116/1.3123330 Document Type: Conference Paper

Times cited : (16)

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