Controlled electropolishing of copper foils at elevated temperature

Applied Surface Science

Volumn 307, Issue , 2014, Pages 731-735

  Kwon, Gi Duk ^a   Kim, Young Woo ^a   Moyen, Eric ^a   Keum, Dong Hoon ^a   Lee, Young Hee ^a,b   Baik, Seunghyun ^a   Pribat, Didier ^a  

^a Sungkyunkwan University   (South Korea)

^b Sungkyunkwan University   (South Korea)

Author keywords

Electropolishing; Elevated temperature; rms roughness; Rolled copper foils; Surface reflectance

Indexed keywords

ATOMIC FORCE MICROSCOPY; BACKSCATTERING; CHEMICAL MECHANICAL POLISHING; COPPER; ELECTROLYTIC POLISHING; POLISHING; REFLECTION; SCANNING ELECTRON MICROSCOPY;

COPPER FOILS; ELECTRON BACKSCATTERING DIFFRACTION; ELECTROPOLISHED; ELEVATED TEMPERATURE; GRAPHENE LAYERS; RMS ROUGHNESS; SPECULAR REFLECTIONS; SURFACE REFLECTANCE;

SURFACE ROUGHNESS;

EID: 84901327655     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2014.04.144     Document Type: Article

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