Low temperature TLP bonding of Al2O3-ceramics using eutectic Au-(Ge, Si) alloys

Journal of Materials Science

Volumn 48, Issue 20, 2013, Pages 7115-7124

  Weyrich, Nico ^a   Leinenbach, Christian ^a  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC SURFACE; INITIAL MELTING TEMPERATURES; INTERFACE REACTIONS; JOINING TEMPERATURE; LOW TEMPERATURES; METALLIC MULTILAYERS; MULTILAYER STRUCTURES; SOLDERING PROCESS;

CERAMIC MATERIALS; CERIUM ALLOYS; DIFFERENTIAL SCANNING CALORIMETRY; EUTECTICS; FILLER METALS; GERMANIUM; JOINING; MECHANICAL PROPERTIES; MELTING POINT; MULTILAYERS; NICKEL; SCANNING ELECTRON MICROSCOPY; SILICON; SOLDERING; WETTING;

SILICON ALLOYS;

EID: 84881119173     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-013-7526-z     Document Type: Article

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