Wetting behavior of ternary Au-Ge-X (X = Sb, Sn) alloys on Cu and Ni

Journal of Electronic Materials

Volumn 42, Issue 6, 2013, Pages 1024-1032

  Jin, S ^a,b   Valenza, F ^c   Novakovic, R ^c   Leinenbach, C ^a  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

^b EPFL   (Switzerland)

^c CNR   (Italy)

Author keywords

Au Ge based solder; High temperature solder; wetting

Indexed keywords

COMPLETE WETTING; CU SUBSTRATE; HIGH TEMPERATURE; NI SUBSTRATES; SN ALLOYS; SOLDER ALLOYS; WETTING BEHAVIOR;

ALLOYS; CONTACT ANGLE; COPPER ALLOYS; DISSOLUTION; GERMANIUM; NICKEL; SOLDERING ALLOYS; TIN; WETTING;

TIN ALLOYS;

EID: 84877753270     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-013-2497-z     Document Type: Article

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