Analysis of microchannel heat exchangers using FEM

International Journal of Numerical Methods for Heat and Fluid Flow

Volumn 11, Issue 1, 2001, Pages 59-75

  Quadir, G A ^a   Mydin, Anvar ^a   Seetharamu, K N ^a  

^a SCHOOL OF PHYSICS   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTATIONAL FLUID DYNAMICS; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; HEAT FLUX; HEAT RESISTANCE; SURFACE PHENOMENA;

MICROCHANNEL HEAT EXCHANGERS;

HEAT SINKS;

EID: 0035156208     PISSN: 09615539     EISSN: None     Source Type: Journal    
DOI: 10.1108/09615530110364097     Document Type: Article

References (25)

1. Copeland, D., Behnia, M. and Nakayama, W. (1996), "Manifold microchannel heat sinks, conjugate and extended analysis", 9th Symp. Trans. Phen. Thermal-Fluid Eng., Singapore, pp. 498-503.
2. Daane, D.A. and Franzon, P.D. (Ed.) (1993), Multichip Module Technologies and Alternatives: The Basics, Van Nostrand Reinhold, New York, NY, pp. 569-613.
3. Gnielinski, V. (1976), "New equations for heat and mass transfer in turbulent pipe and channel flow", International Chemical Engineering, Vol. 16, pp. 359-68.
4. Goldhaber-Gordon, D., Montemerlo, M.S., Love, J. C., Opiteck, G.J. and Ellenbogen, J.C. (1997), "Overview of nanometer devices", Proc. IEEE, Vol. 85 No. 4, pp. 521-40.
5. Harpole, G.M. and Eninger, J.E. (1991), "Microchannel heat exchanger optimization", Seventh IEEE Semi-Therm. Symposium, pp. 59-63.
6. Kim, S.J. and Kim, D. (1999), "Forced convection in microstructures for electronic equipment cooling", ASME J. Heat Transfer, Vol. 121, pp. 639-45.
7. Knight, R.W., Goodling, J.S. and Hall, D.J. (1991), "Optimal thermal design of forced convection heat sinks-Analytical", ASME J. Electronic Packaging, Vol. 113, pp. 313-21.
8. Knight, R.W., Hall, D.J., Goodling, J.S. and Jaeger, R.C. (1992), "Heat sink optimization with application to microchannel", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, Vol. 15 No. 5, pp. 832-42.
9. Koh, J.C.Y. and Colony, R. (1986), "Heat transfer of microstructures for integrated circuits", Int. Comm. Heat Mass Transfer, Vol. 13, pp. 89-98.
10. Leng, C.S. (1997), "Electronic cooling using microchannels", Final Year Project, BSc(Hon), School of Mechanical Engineering, USM(KCP), Malaysia.
11. Lewis, R.W., Morgan, K., Thoma, H.R. and Seetharamu, K.N. (1996), The Finite Element Method in Heat Transfer Analysis, John Wiley and Sons, New York, NY.
12. Mizunuma, H., Behnia, M. and Nakayama, W. (1997), "Heat transfer from micro-finned surfaces to flow of fluorinet coolant in reduced-size channel", IEEE Transactions On Components, Packaging, and Manufacturing Technology - Part-A, Vol. 20 No. 2, pp. 138-45.
13. Philips, R.J. (1990), "Microchannel heat sinks", in Bar-Cohen, A. and Kraus, A.D. (Eds), Advances in Thermal Modeling of Electronic Components and Systems, ASME, pp. 109-84.
14. Ranganayakulu, C. and Seetharamu, K.N. (1999a), "The combined effects of longitudinal heat conduction, flow non-uniformity and temperature non-uniformity in cross flow plate-fin heat exchangers", Int. Comm. In Heat and Mass Transfer, Vol. 26, pp. 669-78.
15. Ranganayakulu, C. and Seetharamu, K.N. (1999b), "The combined effects of wall longitudinal conduction, inlet fluid non-uniformity and temperature non-uniformity in compact tube-fin heat exchangers - a finite element method", Int. Journal of Heat and Mass Transfer Vol. 42 No. 2, pp. 263-73.
16. Salman, V.K. (1989), "Convective heat transfer in microchannel", Journal of Electronic Materials Vol. 18, pp. 611-18.
17. Segerlind, L.J. (1984), Applied Finite Element Methods, John Wiley & Sons, New York, NY.
18. Shah, R.K. and London, A.L. (1978), "Laminar flow forced convection in ducts", Advances in Heat Transfer, Academic, New York, NY, pp. 196-223.
19. Tien, C.L. and Kuo, S.M. (1987), "Analysis of forced convection in microstructures for electronic system cooling", Proc Int. Symp. Cooling Technology for Electronic Equipment, Honolulu, HI, pp. 217-26.
20. Tuckerman, D.B. and Pease, R.F.W. (1981), "High performance heat sink for VLSI", IEEE. Electron Device Letters, Vol. EDL-2 No. 4, pp. 126-9.
21. Vafai, K. and Tien, C.L. (1981), "Boundary and inertia effects on flow and heat transfer in porous media", Int. J. Heat Mass Transfer, Vol. 24, pp. 195-203.
22. Wang, B.X. and Peng, X.F. (1994), "Experimental investigation on liquid forced-convection heat transfer through microchannel", Int. J. Heat Mass Transfer, Vol. 37 Suppl. 1, pp. 73-82.
23. Wiesberg, A., Bau, H.H. and Zamel, J. (1992), "Analysis of microchannels for integrated cooling", Int. J. Heat Mass Transfer, Vol. 35 No. 10, pp. 2465-74.
24. Yeung, T.S., Yeun, M.M.F. and Zohar, Y. (1995), "Heat transfer in microcooling system", 6th Asian Conf. Fluid Mech., Singapore, pp. 785-8.
25. Zhimin, W. and Fah, C.K. (1997), "The optimum thermal design of microchannel heat sinks", IEEE/CPMT Electronic Packaging Technology Conference, pp. 123-9.