-
1
-
-
0036776505
-
Optimization of single and double layer counter flow microchannel heat sinks
-
Chong, S.H., Ooi, K.T. and Wong, T.N. (2002), "Optimization of single and double layer counter flow microchannel heat sinks", Applied Thermal Engineering, Vol.22, pp. 1569-1585.
-
(2002)
Applied Thermal Engineering
, vol.22
, pp. 1569-1585
-
-
Chong, S.H.1
Ooi, K.T.2
Wong, T.N.3
-
2
-
-
13844294435
-
Thermal analysis of micro-channel heat exchangers with two-phase flow using FEM
-
Hegde, P., Seetharamu, K.N., Quadir, G.A., Aswathanarayana, P.A., Abdullah, M.Z. and Zainal, Z.A. (2005), "Thermal analysis of micro-channel heat exchangers with two-phase flow using FEM", International Journal of Numerical Methods for Heat & Fluid Flow, Vol.15 No.1, pp. 43-60.
-
(2005)
International Journal of Numerical Methods for Heat & Fluid Flow
, vol.15
, Issue.1
, pp. 43-60
-
-
Hegde, P.1
Seetharamu, K.N.2
Quadir, G.A.3
Aswathanarayana, P.A.4
Abdullah, M.Z.5
Zainal, Z.A.6
-
4
-
-
13844254919
-
Optimization of thermal resistance of stacked micro-channel using genetic algorithms
-
DOI 10.1108/09615530510571930
-
Jeevan, K., Quadir, G.A., Seetharamu, K.N., Azid, I.A. and Zainal, Z.A. (2005), "Optimization of thermal resistance of stacked micro-channel using genetic algorithms", International Journal of Numerical Methods for Heat & Fluid Flow, Vol.15 No.1, pp. 27-42. (Pubitemid 40242595)
-
(2005)
International Journal of Numerical Methods for Heat and Fluid Flow
, vol.15
, Issue.1
, pp. 27-42
-
-
Jeevan, K.1
Quadir, G.A.2
Seetharamu, K.N.3
Azid, I.A.4
Zainal, Z.A.5
-
5
-
-
0033457941
-
Forced convection in microstructures for electronic equipment cooling
-
Kim, S.J. and Kim, D. (1991), "Forced convection in microstructures for electronic equipment cooling", Journal of Heat Transfer, Vol.21, pp. 639-645.
-
(1991)
Journal of Heat Transfer
, vol.21
, pp. 639-645
-
-
Kim, S.J.1
Kim, D.2
-
6
-
-
0029492853
-
High Performance forced air cooling scheme employing micro channel heat exchangers
-
Kleiner, M.B., Kuehn, S.A. and Haberger, K. (1995), "High performance forced air cooling scheme employing micro channel heat exchangers", IEEE Transactions on Components, Packaging and Manufacturing Technology Part A, Vol.18 No.4, pp. 795-804.
-
(1995)
IEEE Transactions on Components, Packaging and Manufacturing Technology Part A
, vol.18
, Issue.4
, pp. 795-804
-
-
Kleiner, M.B.1
Kuehn, S.A.2
Haberger, K.3
-
7
-
-
3242717935
-
Three-dimensional analysis of heat transfer in a microheat sink with single phase flow
-
Li, J., Peterson, G.P. and Cheng, P. (2004), "Three-dimensional analysis of heat transfer in a microheat sink with single phase flow", International Journal of Heat and Mass Transfer, Vol.47,pp. 4215-4231.
-
(2004)
International Journal of Heat and Mass Transfer
, vol.47
, pp. 4215-4231
-
-
Li, J.1
Peterson, G.P.2
Cheng, P.3
-
8
-
-
13844280952
-
Analysis and optimization of the thermal performance of microchannel heat sinks
-
Liu, D. and Garimella, S.V. (2005), "Analysis and optimization of the thermal performance of microchannel heat sinks", International Journal of Numerical Methods for Heat & Fluid Flow, Vol.15 No.1, pp. 7-26.
-
(2005)
International Journal of Numerical Methods for Heat & Fluid Flow
, vol.15
, Issue.1
, pp. 7-26
-
-
Liu, D.1
Garimella, S.V.2
-
9
-
-
0142258122
-
Microscopic and macroscopic approach for natural convection in enclosures filled with fluid saturated porous medium
-
Massarotti, N., Nithiarasu, P. and Carotenuto, A. (2003), "Microscopic and macroscopic approach for natural convection in enclosures filled with fluid saturated porous medium", International Journal of Numerical Methods for Heat & Fluid Flow, Vol.13 No.7, pp. 862-886.
-
(2003)
International Journal of Numerical Methods for Heat & Fluid Flow
, vol.13
, Issue.7
, pp. 862-886
-
-
Massarotti, N.1
Nithiarasu, P.2
Carotenuto, A.3
-
10
-
-
0035156208
-
Analysis of microchannel heat exchangers using FEM
-
Quadir, G.A., Mydin, A. and Seetharamu, K.N. (2001), "Analysis of microchannel heat exchangers using FEM", International Journal of Numerical Methods for Heat & Fluid Flow, Vol.11 No.1, pp. 59-76.
-
(2001)
International Journal of Numerical Methods for Heat & Fluid Flow
, vol.11
, Issue.1
, pp. 59-76
-
-
Quadir, G.A.1
Mydin, A.2
Seetharamu, K.N.3
-
11
-
-
0037030148
-
Numerical optimization of the thermal performance of a microchannel heat sink
-
Ryu, J.H., Choi, D.H. and Kim, S.J. (2002), "Numerical optimization of the thermal performance of a microchannel heat sink", International Journal of Heat and Mass Transfer, Vol.45, pp. 2823-2827.
-
(2002)
International Journal of Heat and Mass Transfer
, vol.45
, pp. 2823-2827
-
-
Ryu, J.H.1
Choi, D.H.2
Kim, S.J.3
-
12
-
-
34547677689
-
Optimization design of microchannel cooling heat sink
-
Shao, B.D., Sun, Z.W. and Wang, L.F. (2007), "Optimization design of microchannel cooling heat sink", International Journal of Numerical Methods for Heat & Fluid Flow, Vol.17 No.6, pp. 628-637.
-
(2007)
International Journal of Numerical Methods for Heat & Fluid Flow
, vol.17
, Issue.6
, pp. 628-637
-
-
Shao, B.D.1
Sun, Z.W.2
Wang, L.F.3
-
13
-
-
4444244253
-
Multi-layered SiC microchannel heat sink-modeling and experiment
-
Skandakumaran, P., Ortega, A., Jamal-Eddine, T., et al. (2004), "Multi-layered SiC microchannel heat sink-modeling and experiment", 2004 International Society Conference on Thermal Phenomena, pp. 352-360.
-
(2004)
2004 International Society Conference on Thermal Phenomena
, pp. 352-360
-
-
Skandakumaran, P.1
Ortega, A.2
Jamal-Eddine, T.3
-
14
-
-
0019563707
-
High-performance heat sinking for VLSI
-
Tuckerman, D.B. and Pease, R.F.W. (1981a), "High-performance heat sinking for VLSI", IEEE Electron Device Letter, Vol.2 No.5, pp. 126-129.
-
(1981)
IEEE Electron Device Letter
, vol.2
, Issue.5
, pp. 126-129
-
-
Tuckerman, D.B.1
Pease, R.F.W.2
-
16
-
-
0037804797
-
Optimization study of stacked micro-channel heat sinks for microelectronic cooling
-
Wei, X.-J. and Joshi, Y. (2003), "Optimization study of stacked micro-channel heat sinks for microelectronic cooling", IEEE Transactions on Components and Packaging Technologies, Vol.26 No.1, pp. 55-61.
-
(2003)
IEEE Transactions on Components and Packaging Technologies
, vol.26
, Issue.1
, pp. 55-61
-
-
Wei, X.-J.1
Joshi, Y.2
-
17
-
-
0037908834
-
An experimental study of convective heat transfer in silicon microchannels with different surface conditions
-
Wu, H.Y. and Cheng, P. (2003), "An experimental study of convective heat transfer in silicon microchannels with different surface conditions", International Journal of Heat and Mass Transfer, Vol.46 No.14, pp. 2547-2556.
-
(2003)
International Journal of Heat and Mass Transfer
, vol.46
, Issue.14
, pp. 2547-2556
-
-
Wu, H.Y.1
Cheng, P.2
-
18
-
-
21144456018
-
Focus of current world heat transfer field-cooling of microelectronics devices
-
Zeng-Yuan, G. (1988), "Focus of current world heat transfer field-cooling of microelectronics devices", Chinese Science Fund, No.2, pp. 20-25
-
(1988)
Chinese Science Fund
, Issue.2
, pp. 20-25
-
-
Zeng-Yuan, G.1
|